A mixed pitch method of placing pads in a ball grid array (BGA) package having a BGA substrate and a plurality of connectors arranged in an array and connected via the pads to the BGA substrate. Selected pairs of the pads are placed on the BGA substrate at a distance defined by a first pitch P1. Ground pads are placed on the BGA substrate at a distance from the selected pairs of pads defined by a second pitch P2, wherein P2=M*P1 and M is greater than one. The selected pairs of the pads on the BGA substrate are also placed at a distance from other selected pairs of the pads defined by the second pitch P2.