Invention Grant
- Patent Title: Remote SIM provisioning
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Application No.: US17216429Application Date: 2021-03-29
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Publication No.: US11653197B2Publication Date: 2023-05-16
- Inventor: Abhi Umeshkumar Shah , Rajashekar Chilla , Lakshmi Bhavani Garimella Srivenkata , Mrudula Sekar , Alan Soloway
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: The Marbury Law Group, PLLC
- Main IPC: H04W4/00
- IPC: H04W4/00 ; H04M3/42 ; H04W8/26 ; H04W4/70 ; H04W8/18 ; H04W8/20

Abstract:
Various aspects include methods for supporting remote Subscriber Identity Module (SIM) profile provisioning that may be performed by a Lightweight Machine-to-Machine (LwM2M) server and LwM2M client computing devices, such as Internet of Things (IoT) devices. A LwM2M server may generate a remote SIM provisioning object for the LwM2M client computing device indicating that the SIM profile update for the LwM2M client computing device is available, and send the remote SIM provisioning object to the LwM2M client computing device. A LwM2M client computing device may receive a remote Subscriber Identity Module (SIM) provisioning object from a LwM2M server indicating that a SIM profile update for the LwM2M client computing device is available, and download the SIM profile update in response to receiving the remote SIM provisioning object.
Public/Granted literature
- US20220141652A1 Remote SIM Provisioning Public/Granted day:2022-05-05
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