Invention Grant
- Patent Title: Chip component
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Application No.: US17752200Application Date: 2022-05-24
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Publication No.: US11657932B2Publication Date: 2023-05-23
- Inventor: Naoto Oka
- Applicant: KOA CORPORATION
- Applicant Address: JP Ina
- Assignee: KOA CORPORATION
- Current Assignee: KOA CORPORATION
- Current Assignee Address: JP Nagano
- Agency: Oliff PLC
- Priority: JP 2021097359 2021.06.10
- Main IPC: H01C7/00
- IPC: H01C7/00 ; H01C1/142

Abstract:
A chip resistor including: a rectangular parallelepiped insulating substrate; a strip-shaped resistor; a pair of front electrodes formed on a front surface of the resistor at both ends in the longitudinal direction; an insulating protective layer; and a pair of end face electrodes formed at both ends of the insulating substrate in the longitudinal direction, each of which is connected to each end face of the resistor, corresponding one of the front electrodes, and protective film; and a pair of external electrodes, wherein a cross-sectional shape of each of the front electrodes is almost a triangle in which a side of the end face has a maximum height, and a shape of an end face of each of the end face electrodes is almost a square.
Public/Granted literature
- US20220399140A1 CHIP COMPONENT Public/Granted day:2022-12-15
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