Invention Grant
- Patent Title: Integrated embedded transformer module
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Application No.: US16910599Application Date: 2020-06-24
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Publication No.: US11657951B2Publication Date: 2023-05-23
- Inventor: Takayuki Tange
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Nagaokakyo
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Main IPC: H01F17/00
- IPC: H01F17/00 ; H01F17/04 ; H01F27/02 ; H01F27/24 ; H01F27/26 ; H01F27/28 ; H01F27/29 ; H01F27/30 ; H01F27/32 ; H01F27/40 ; H01F27/255 ; H01F41/00 ; H01F41/04 ; H05K1/02 ; H05K1/16 ; H05K1/18 ; H01F41/02

Abstract:
An embedded transformer module device includes an insulating substrate including a first side and a second side opposite to the first side and including a first cavity, a magnetic core in the first cavity, a primary winding wound horizontally around the magnetic core and having a spiral shape with more than one turn, and a secondary winding wound horizontally around the magnetic core, spaced away from the primary winding, and having a spiral shape with more than one turn.
Public/Granted literature
- US20210407727A1 INTEGRATED EMBEDDED TRANSFORMER MODULE Public/Granted day:2021-12-30
Information query
IPC分类:
H | 电学 |
H01 | 基本电气元件 |
H01F | 磁体;电感;变压器;磁性材料的选择 |
H01F17/00 | 信号类型的固定电感器 |