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公开(公告)号:US10672554B2
公开(公告)日:2020-06-02
申请号:US16046092
申请日:2018-07-26
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Norio Sakai , Yoshihito Otsubo , Hideaki Hashi , Takayuki Tange , Munetake Miyashita , Takeshi Wake , Yasuhiro Higashide
IPC: H01F27/00 , H01F27/29 , H01F41/10 , H01F17/04 , H05K3/28 , H01F27/28 , H01F41/04 , H01F17/00 , H01F27/24 , H01F27/32 , H01F41/02 , H05K1/11 , H05K1/18 , H01F27/02
Abstract: An inductor component 1a includes a resin layer 3 and an inductor electrode 6. The inductor electrode 6 includes metal pins 7a to 7d that extend in the resin layer 3 with upper end surfaces thereof exposed from the upper surface 3a of the resin layer 3, and upper wiring plates 8a and 8b that are disposed on the upper surface 3a of the resin layer 3 and that connect upper end surfaces of the short metal pins 7a and 7c and upper end surfaces of the long metal pins 7b and 7d to each other. In this case, the inductor electrode 6 is formed of the metal pins 7a to 7d and wiring plates 8a to 8c that each have a specific electrical resistance lower than that of a conductive paste and plating, and the resistance of the entire inductor electrode 6 can be decreased.
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公开(公告)号:US12148693B2
公开(公告)日:2024-11-19
申请号:US17640991
申请日:2020-10-07
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Takayuki Tange , Yoshimitsu Ushimi
Abstract: A transformer includes a silicon substrate, a plurality of metal layers and a plurality of insulating layers laminated on the silicon substrate, a bottom winding of a metal contacting a first metal layer and a second metal layer of the plurality of metal layers, a first insulating layer on the bottom winding, a core on the first insulating layer, a second insulating layer on the core, a top winding of the metal that extends around the core and a portion of the second insulating layer, and a third insulating layer on the top winding. At least one of the top winding and the bottom winding is thicker than each of the plurality of metal layers.
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公开(公告)号:US10714252B2
公开(公告)日:2020-07-14
申请号:US16438516
申请日:2019-06-12
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Munetake Miyashita , Yuji Tamura , Takayuki Tange , Hideaki Hashi , Takeshi Wake , Yasuhiro Higashide
IPC: H01F27/29 , H01F27/245 , H01F17/04 , H01F27/28 , H01F41/02 , H02M3/155 , H01F27/24 , H01F17/00 , H02M1/00
Abstract: An inductor includes a first terminal and a second terminal, a first inductor conductor layer and a second inductor conductor layer, a magnetic core layer, and via conductors. The magnetic core layer is disposed between the first and second inductor conductor layers. The via conductors are connected to the first and second inductor conductor layers. The first and second terminals are electrically connected through the via conductors. The magnetic core layer includes a first magnetic substance portion including a first magnetic substance, and a second magnetic substance portion including a second magnetic substance. Magnetic properties of the second magnetic substance are different from magnetic properties of the first magnetic substance.
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公开(公告)号:US12212243B2
公开(公告)日:2025-01-28
申请号:US17875696
申请日:2022-07-28
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Takayuki Tange
Abstract: A converter includes first and second input terminals; an integrated circuit (IC) that is a non-resonant, step-down, and point-of-load IC, that is connected to the first and second input terminals, and that includes a feedback terminal and switch-output terminal; a voltage-sense circuit connected to the feedback terminal and the switch-output terminal; a transformer that includes a primary winding connected to the switch-output terminal; a capacitor connected in series with the primary winding; a rectifier connected to a secondary winding of the transformer; and first and second output terminals connected to the rectifier. The converter is operated in a resonate mode.
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公开(公告)号:US11978581B2
公开(公告)日:2024-05-07
申请号:US16924666
申请日:2020-07-09
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Lee Francis , William Jarvis , Takayuki Tange , Shouhei Hirose
IPC: H01F27/28 , H01F17/06 , H01F27/255
CPC classification number: H01F27/2895 , H01F17/062 , H01F27/255 , H01F27/2828
Abstract: A magnetic-component module includes a substrate, a core on a first surface of the substrate, a spacer on the core, a gap between a bottom surface of the core and the first surface of the substrate, a winding including wire bonds extending over the core and electrically connecting a first portion of the substrate and a second portion of the substrate, and traces on and/or in the substrate, and an overmold material encapsulating the core, the spacer, and the wire bonds and filling the gap.
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公开(公告)号:US10602614B2
公开(公告)日:2020-03-24
申请号:US16143509
申请日:2018-09-27
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Takayuki Tange , Yasuhiro Higashide , Takeshi Wake , Munetake Miyashita
Abstract: A power supply module includes first and second outer surfaces that are adjacent to and perpendicular or substantially perpendicular to each other. The power supply module includes a substrate that includes a first surface and a side surface, electronic components mounted at least on the first surface, a first resin material provided on the first surface, and terminal electrodes exposed at least at the first outer surface. The first resin member seals the electronic components mounted on the first surface. In the substrate, the first surface is perpendicular or substantially perpendicular to the first outer surface, which extends at least across the side surface of the substrate and the first resin member. The area of the first outer surface is smaller than the area of the second outer surface.
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公开(公告)号:US12165798B2
公开(公告)日:2024-12-10
申请号:US16924240
申请日:2020-07-09
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Lee Francis , William Jarvis , Takayuki Tange
Abstract: A magnetic-component module includes a substrate; a core on a first surface of the substrate; a spacer on the core; a winding including wire bonds extending over the core and electrically connecting a first portion of the substrate and a second portion of the substrate, and traces on and/or in the substrate; and an overmold material encapsulating the core, the spacer, and the wire bonds.
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公开(公告)号:US11984254B2
公开(公告)日:2024-05-14
申请号:US16924668
申请日:2020-07-09
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Lee Francis , William Jarvis , Takayuki Tange
IPC: H01F27/28 , H01F17/06 , H01F27/255 , H01F27/42
CPC classification number: H01F27/2828 , H01F17/062 , H01F27/255 , H01F27/425
Abstract: A magnetic-component module includes a substrate, a core on a first surface of the substrate, a spacer on the core, a winding including wire bonds extending over the core and electrically connecting a first portion of the substrate and a second portion of the substrate, and traces on and/or in the substrate, a lead frame that supports the core and that electrically connects the winding to the substrate, and an overmold material encapsulating the core, the spacer, the wire bonds, and a portion of the lead frame.
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公开(公告)号:US11657951B2
公开(公告)日:2023-05-23
申请号:US16910599
申请日:2020-06-24
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Takayuki Tange
IPC: H01F17/00 , H01F17/04 , H01F27/02 , H01F27/24 , H01F27/26 , H01F27/28 , H01F27/29 , H01F27/30 , H01F27/32 , H01F27/40 , H01F27/255 , H01F41/00 , H01F41/04 , H05K1/02 , H05K1/16 , H05K1/18 , H01F41/02
CPC classification number: H01F27/2804 , H01F27/24 , H01F27/327 , H01F41/0206 , H01F41/041 , H05K1/182 , H01F2027/2809 , H05K2201/1003
Abstract: An embedded transformer module device includes an insulating substrate including a first side and a second side opposite to the first side and including a first cavity, a magnetic core in the first cavity, a primary winding wound horizontally around the magnetic core and having a spiral shape with more than one turn, and a secondary winding wound horizontally around the magnetic core, spaced away from the primary winding, and having a spiral shape with more than one turn.
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公开(公告)号:US11456106B2
公开(公告)日:2022-09-27
申请号:US16269587
申请日:2019-02-07
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Munetake Miyashita , Takayuki Tange , Hideaki Hashi
IPC: H01F27/29 , H01F27/28 , H02M3/155 , H01F37/00 , H05K1/18 , H02M3/28 , H01F17/04 , H01F17/00 , H01F27/24 , H02M7/00 , H02M3/335
Abstract: An inductor component includes cores, a coil disposed in the cores, and terminal electrodes. The coil includes first metal plates disposed on an upper surface of the cores, second metal plates disposed on a lower surface of the cores, and a plurality of metal pins each passing through one of the cores in a thickness direction. The coil has a helical shape by connecting the first metal plates to the second metal plates, with the plurality of metal pins therebetween. The terminal electrodes are spaced apart along a direction in which the helical shape extends, and are connected to the coil.
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