Silicon transformer integrated chip

    公开(公告)号:US12148693B2

    公开(公告)日:2024-11-19

    申请号:US17640991

    申请日:2020-10-07

    Abstract: A transformer includes a silicon substrate, a plurality of metal layers and a plurality of insulating layers laminated on the silicon substrate, a bottom winding of a metal contacting a first metal layer and a second metal layer of the plurality of metal layers, a first insulating layer on the bottom winding, a core on the first insulating layer, a second insulating layer on the core, a top winding of the metal that extends around the core and a portion of the second insulating layer, and a third insulating layer on the top winding. At least one of the top winding and the bottom winding is thicker than each of the plurality of metal layers.

    Resonance operation of DC-DC converter using a point-of-load integrated circuit

    公开(公告)号:US12212243B2

    公开(公告)日:2025-01-28

    申请号:US17875696

    申请日:2022-07-28

    Inventor: Takayuki Tange

    Abstract: A converter includes first and second input terminals; an integrated circuit (IC) that is a non-resonant, step-down, and point-of-load IC, that is connected to the first and second input terminals, and that includes a feedback terminal and switch-output terminal; a voltage-sense circuit connected to the feedback terminal and the switch-output terminal; a transformer that includes a primary winding connected to the switch-output terminal; a capacitor connected in series with the primary winding; a rectifier connected to a secondary winding of the transformer; and first and second output terminals connected to the rectifier. The converter is operated in a resonate mode.

    Power supply module and power supply device

    公开(公告)号:US10602614B2

    公开(公告)日:2020-03-24

    申请号:US16143509

    申请日:2018-09-27

    Abstract: A power supply module includes first and second outer surfaces that are adjacent to and perpendicular or substantially perpendicular to each other. The power supply module includes a substrate that includes a first surface and a side surface, electronic components mounted at least on the first surface, a first resin material provided on the first surface, and terminal electrodes exposed at least at the first outer surface. The first resin member seals the electronic components mounted on the first surface. In the substrate, the first surface is perpendicular or substantially perpendicular to the first outer surface, which extends at least across the side surface of the substrate and the first resin member. The area of the first outer surface is smaller than the area of the second outer surface.

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