Invention Grant
- Patent Title: Vertical trench gate MOSFET with integrated Schottky diode
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Application No.: US16237210Application Date: 2018-12-31
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Publication No.: US11658241B2Publication Date: 2023-05-23
- Inventor: Sunglyong Kim , Seetharaman Sridhar , Hong Yang , Ya Ping Chen , Thomas Eugene Grebs
- Applicant: Texas Instruments Incorporated
- Applicant Address: US TX Dallas
- Assignee: Texas Instruments Incorporated
- Current Assignee: Texas Instruments Incorporated
- Current Assignee Address: US TX Dallas
- Agent Andrew R. Ralston; Frank D. Cimino
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L27/088 ; H01L29/423 ; H01L29/872 ; H01L21/8234 ; H01L29/40

Abstract:
An integrated circuit includes a trench gate MOSFET including MOSFET cells. Each MOSFET cell includes an active trench gate in an n-epitaxial layer oriented in a first direction with a polysilicon gate over a lower polysilicon portion. P-type body regions are between trench gates and are separated by an n-epitaxial region. N-type source regions are located over the p-type regions. A gate dielectric layer is between the polysilicon gates and the body regions. A metal-containing layer contacts the n-epitaxial region to provide an anode of an embedded Schottky diode. A dielectric layer over the n-epitaxial layer has metal contacts therethrough connecting to the n-type source regions, to the p-type body regions, and to the anode of the Schottky diode.
Public/Granted literature
- US20200212219A1 VERTICAL TRENCH GATE MOSFET WITH INTEGRATED SCHOTTKY DIODE Public/Granted day:2020-07-02
Information query
IPC分类: