Invention Grant
- Patent Title: Open-ear headphone
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Application No.: US17474987Application Date: 2021-09-14
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Publication No.: US11659313B2Publication Date: 2023-05-23
- Inventor: Joel Miller , Todd Reily
- Applicant: Bose Corporation
- Applicant Address: US MA Framingham
- Assignee: BOSE CORPORATION
- Current Assignee: BOSE CORPORATION
- Current Assignee Address: US MA Framingham
- Agency: Bose Corporation
- Main IPC: H04R1/10
- IPC: H04R1/10 ; H04R5/027 ; H04R1/08

Abstract:
An open-ear headphone with an acoustic module that is configured to be located at least in part in a concha of an outer ear of a user. The acoustic module includes an acoustic transducer, and a sound-emitting opening that is configured to emit sound produced by the acoustic transducer. A body is coupled to the acoustic module and includes a first portion that is configured to pass over an outer side of at least one of an anti-helix and a helix and a lobule of the outer ear, and a second portion that is configured to be located behind the outer ear.
Public/Granted literature
- US20220353598A1 Open-Ear Headphone Public/Granted day:2022-11-03
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