Invention Grant
- Patent Title: Stretchable wiring board
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Application No.: US17847233Application Date: 2022-06-23
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Publication No.: US11659656B2Publication Date: 2023-05-23
- Inventor: Takahito Tomoda
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Nagaokakyo
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Nagaokakyo
- Agency: ArentFox Schiff LLP
- Priority: JP 2019007740 2019.01.21
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/18

Abstract:
A stretchable wiring board that includes a stretchable substrate having a first main surface with a first region, a second region adjacent the first region, and a third region adjacent the second region; a first stretchable wiring line on the first main surface and extending over the first region; an insulating layer extending over the first region and the second region; and a second stretchable wiring line extending over the first region, the second region, and the third region. When a thickness of the insulating layer is defined as Z2, and when a minimum value of a length of the second region in an extending direction of the second stretchable wiring line in a plan view of the stretchable wiring board is defined as Y, Y>Z2.
Public/Granted literature
- US20220330424A1 STRETCHABLE WIRING BOARD Public/Granted day:2022-10-13
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