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1201 条记录 (耗时 0.034 秒)

    Use of surplus erase block pairs in super block formation
    3.
    发明授权
    Use of surplus erase block pairs in super block formation 有权

    公开(公告)号：US11640259B2

    公开(公告)日：2023-05-02

    申请号：US16880772

    申请日：2020-05-21

    申请人： WESTERN DIGITAL TECHNOLOGIES, INC.

    发明人： Jeevani Alwala

    IPC分类号： G06F3/06

    摘要： Aspects of a storage device including at least one die and a controller are provided that allow superblock formation using surplus block pairs when bad blocks occur. After the controller forms a superblock including a first block in a first plane of the die and a second block in a second plane of the die, the controller identifies the first block as a bad block and switches the second block into a surplus state (or vice-versa). The controller then forms a new superblock from blocks in a spare pool. When the number of blocks is equal to a superblock threshold, the controller attempts to pair the surplus block with another surplus block from the opposite plane according to a die sequence. If the attempt to pair is successful, the controller adds the pair to the spare pool; otherwise, the surplus block is not added to the spare pool.

    Pattern addressing for session-based DASH operations
    7.
    发明授权
    Pattern addressing for session-based DASH operations 有权

    公开(公告)号：US11638056B2

    公开(公告)日：2023-04-25

    申请号：US17501664

    申请日：2021-10-14

    申请人： Tencent America LLC

    发明人： Iraj Sodagar

    IPC分类号： H04N21/266 ,  H04N21/2662 ,  H04N21/4402

    摘要： A method of session-based DASH operations can include receiving a media presentation description (MPD) referencing a session-based description (SBD) and indicating a key name during a media access session. The SBD includes a first repeating pattern element that includes a first sequence of timed key values of the key name. The first repeating pattern element indicates that the first sequence of the timed key values of the key name is relocated along a timeline or an orderline. A first key value of the key name corresponding to a timing or a segment number of a current segment of a sequence of segments can be determined based on the first repeating pattern element in the SBD. A request for the current segment can be transmitted to a media content server. The request includes a pair of the key name and the first key value.

    Method and apparatus for video coding
    8.
    发明授权
    Method and apparatus for video coding 有权

    公开(公告)号：US11638022B2

    公开(公告)日：2023-04-25

    申请号：US17447149

    申请日：2021-09-08

    申请人： Tencent America LLC

    发明人： Xiang Li ,  Xiaozhong Xu ,  Shan Liu

    IPC分类号： H04N19/44 ,  H04N19/51

    摘要： Aspects of the disclosure provide a method and an apparatus for video decoding. Processing circuitry of the apparatus can decode prediction information of a current block to be reconstructed from a coded video bitstream. The prediction information can be indicative of an inter prediction mode. The processing circuitry can add motion information of a previously decoded block to a candidate list for the current block as a new motion information candidate based on a comparison between a first hash value of the motion information of the previously decoded block and one or more hash values of motion information candidates in the candidate list. The processing circuitry can reconstruct at least one sample of the current block based on current motion information of the current block that is determined based on the candidate list.

    Cell system
    9.
    发明授权
    Cell system 有权

    公开(公告)号：US11637334B2

    公开(公告)日：2023-04-25

    申请号：US17289621

    申请日：2020-12-14

    申请人： APB Corporation

    发明人： Hideaki Horie ,  Yasuhiro Shindo ,  Yusuke Mizuno ,  Ryosuke Kusano ,  Yuki Nekohashi ,  Yusuke Nakashima ,  Kotaro Nasu ,  Naoya Omae

    IPC分类号： H01M10/613 ,  H01M10/6564 ,  H01M10/6567 ,  H01M50/209 ,  H01M4/66 ,  H01M10/0525 ,  H01M10/48

    摘要： A cell system includes: a stacked-type cell module (100) having a plurality of lithium ion unit cells (1) being stacked and having through holes (3a, 3b) formed therein; a gas supply part (31); a cooling liquid supply part (32); a temperature sensor (35); and a control part (36) that controls switching between a normal control mode and a high-temperature control mode based on a signal from the temperature sensor (35). In the normal control mode, the control part (36) controls the gas supply part (31) to supply a gas to the through holes (3a, 3b), and at the same time, controls the cooling liquid supply part (32) to stop supply of a cooling liquid, and in the high-temperature control mode, the control part (36) controls the cooling liquid supply part (32) to supply the cooling liquid to the through holes (3a, 3b) to which the gas is supplied, and at the same time, controls the gas supply part (31) to stop supply of the gas. According to this cell system, the increase in temperature of the cell is suppressed while having a simple configuration with a reduced formation region of through holes provided in a lithium ion cell.

    Die emitting white light
    10.
    发明授权
    Die emitting white light 有权

    公开(公告)号：US11637224B2

    公开(公告)日：2023-04-25

    申请号：US17032547

    申请日：2020-09-25

    申请人： BRIDGELUX, INC.

    发明人： Babak Imangholi ,  Khashayar Phil Oliaei ,  Scott West

    IPC分类号： H01L33/50 ,  H01L33/00 ,  H01L33/56 ,  H01L33/62

    摘要： Various methods and apparatuses are disclosed. A method may include disposing at least one die on a location on a carrier substrate, forming at least one stud bump on each of at least one die, forming a phosphor layer on the at least one stud bump and the at least one die, removing a top portion of the phosphor layer to expose the at least one stud bump, and removing a side portion of the phosphor layer located between two adjacent dies. An apparatus may include a die comprising top, bottom, and side surfaces. A phosphor layer may be disposed on the top, bottom, and side surfaces of the die. The phosphor layer may have substantially equal thicknesses on the top and side surfaces of the die as well as one or more stud bumps disposed on the top surface of the die.