- 专利标题： Curable silicone composition, optical semiconductor device and a method of manufacturing the same
-
申请号： US16931657申请日： 2020-07-17
-
公开(公告)号： US11661515B2公开(公告)日： 2023-05-30
- 发明人: Shunya Takeuchi , Sawako Inagaki , Akito Hayashi
- 申请人： DuPont Toray Specialty Materials Kabushiki Kaisha
- 申请人地址： JP Tokyo
- 专利权人： DuPont Toray Specialty Materials Kabushiki Kaisha
- 当前专利权人： DuPont Toray Specialty Materials Kabushiki Kaisha
- 当前专利权人地址： JP Tokyo
- 代理机构： Howard & Howard Attorneys PLLC
- 优先权： JP 2019139793 2019.07.30
- 主分类号： C08L83/04
- IPC分类号： C08L83/04 ; C09D183/04 ; C08G77/08
摘要：
A curable silicone composition encapsulates, coats, or adheres an optical semiconductor element. The curable silicone composition can form a cured product with sufficiently low gas-permeability, and with little weight decrease and little change in hardness even on long-term exposure to high temperatures. The curable silicone composition comprises resinous organopolysiloxane that contains at least one (Ar2SiO2/2) unit, wherein Ar denotes an aryl group.
公开/授权文献
信息查询
