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    Curable white silicone formulation, a reflective material for optical semiconductor module, and optical semiconductor device
    3.
    发明授权
    Curable white silicone formulation, a reflective material for optical semiconductor module, and optical semiconductor device 有权

    公开(公告)号：US11634580B2

    公开(公告)日：2023-04-25

    申请号：US17129181

    申请日：2020-12-21

    申请人： DuPont Toray Specialty Materials Kabushiki Kaisha

    发明人： Sosuke Yamaguchi

    IPC分类号： C08L83/04 ,  C08G77/12

    摘要： A white curable silicone composition provides excellent elongation characteristics while providing sufficiently great hardness, which as a result can provide a cured product having excellent toughness.
    The composition comprises: (A) alkenyl group-containing resinous organopolysiloxane which is represented by an average composition formula: (R13SiO1/2)a(R12SiO2/2)b(R1SiO3/2)c(SiO4/2)d(XO1/2)e, where, in the formula, R1 are each independently a monovalent hydrocarbon group, while at least two R1 are alkenyl groups, X is a hydrogen atom or an alkyl group, 0≤a≤0.7, 0≤b≤0.2, 0≤c≤0.3, 0≤d≤0.8, and 0≤e≤0.2, a+b+c+d=1.0, and c+d>0 are satisfied; (B) linear alkenyl group-containing organopolysiloxane which is represented by R2R32SiO(R32SiO)nSiOR2R32, where, in the formula, R2 is an alkenyl group, R3 are each independently a monovalent hydrocarbon group other than an alkenyl group, and n is an integer of 50 or greater; (C) organohydrogenpolysiloxane having at least two hydrogen atom-bonded silicon atoms in one molecule; (D) a catalyst for curing reaction; and (E) a white pigment, wherein the component (A) is included in an amount of 20 mass % or more based on the total mass of the organopolysiloxane components, and the alkenyl group content in the components (A) to (C) is 1.7 mass % or less.

    Curable silicone composition, encapsulant and optical semiconductor device
    7.
    发明授权
    Curable silicone composition, encapsulant and optical semiconductor device 有权

    公开(公告)号：US11939472B2

    公开(公告)日：2024-03-26

    申请号：US17663604

    申请日：2022-05-16

    申请人： DuPont Toray Specialty Materials Kabushiki Kaisha

    发明人： Yutaka Oka

    IPC分类号： C08L83/04

    CPC分类号： C08L83/04 ,  C08L2203/20 ,  C08L2205/025

    摘要： A Curable Silicone Composition, Encapsulant And Optical Semiconductor Device provides a curable silicone composition having excellent storage stability at room temperature. A curable silicone composition having (A) a resinous alkenyl group-containing organopolysiloxane including at least two alkenyl groups per molecule and at least one siloxane unit represented by SiO4/2; (B) an organohydrogenpolysiloxane having at least two silicon atom-bonded hydrogen atoms in one molecule; (C) an alkyne group-containing compound; and (D) a curing catalyst, wherein the content of the resinous alkenyl group-containing organopolysiloxane (A) is 20 mass % or more based on the total mass of the organopolysiloxane components.

    UV CURABLE SILICONE COMPOSITION AND AN ENCAPSULANT OR A SHEET FILM THEREOF
    8.
    发明公开
    UV CURABLE SILICONE COMPOSITION AND AN ENCAPSULANT OR A SHEET FILM THEREOF 审中-公开

    公开(公告)号：US20230348721A1

    公开(公告)日：2023-11-02

    申请号：US18219833

    申请日：2023-07-10

    申请人： Rohm and Haas Electronic Materials Korea Ltd. ,  Rohm and Haas Electronic Materials LLC ,  DuPont Toray Specialty Materials Kabushiki Kaisha

    发明人： Shunya Takeuchi ,  Anna Ya Ching Feng ,  Yutaka Oka ,  Jung Hye Chae

    IPC分类号： C08L83/04 ,  C08G77/20 ,  C08G77/28 ,  C08G77/00 ,  C08K5/132 ,  C08K5/18 ,  C08K5/5397

    CPC分类号： C08L83/04 ,  C08G77/20 ,  C08G77/28 ,  C08G77/80 ,  C08K5/132 ,  C08K5/18 ,  C08K5/5397 ,  C08L2312/06 ,  C08L2201/08 ,  C08L2201/10 ,  C08L2203/16 ,  C08L2203/206 ,  C08L2205/025 ,  C08L2205/03

    摘要： A UV curable silicone composition has exceptional curability by ultraviolet irradiation. The UV curable silicone composition includes (A) an organopolysiloxane composition selected from the following: (A-1) an organopolysiloxane composition comprising a linear organopolysiloxane in which both ends of the molecular chain are capped with alkenyl groups and/or a branched organopolysiloxane containing at least 2 alkenyl groups at the ends of the molecular chain, and an organopolysiloxane containing at least 2 thiol groups in side-chains of the molecular chain, wherein the thiol group content is 1% by mass or more per molecule, (A-2) an organopolysiloxane composition comprising a linear organopolysiloxane in which both ends of the molecular chain are capped with thiol groups, wherein the thiol group content is 1% by mass or more per molecule, and an organopolysiloxane containing at least 2 alkenyl groups in side-chains of the molecular chain and/or a resinous organopolysiloxane containing at least 2 alkenyl groups at the ends of the molecular chain, or (A-3) an organopolysiloxane composition comprising an alkenyl group- and aryl group-containing organopolysiloxane and a multifunctional thiol compound, but furthermore comprising an alkenyl group-containing resinous organopolysiloxane when the multifunctional thiol compound contains only a bifunctional thiol compound, and (B) a silicone-compatible photo-initiator comprising a compound selected from the following: (B-1) an alpha-hydroxyacetophenone, (B-2) a combination of an alpha-hydroxyacetophenone and an alpha-aminoalkylphenone, or (B-3) a combination of an alpha-hydroxyacetophenone and a mono-acylphosphine oxide, wherein the ratio between the thiol groups and alkenyl groups (SH/Vi ratio) included in the organopolysiloxane composition is 0.6 or more.