Invention Grant
- Patent Title: Edge couplers in the back-end-of-line stack of a photonics chip
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Application No.: US17151955Application Date: 2021-01-19
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Publication No.: US11662523B2Publication Date: 2023-05-30
- Inventor: Yusheng Bian , Roderick A. Augur , Kenneth J. Giewont , Karen Nummy
- Applicant: GLOBALFOUNDRIES U.S. Inc.
- Applicant Address: US CA Santa Clara
- Assignee: GlobalFoundries U.S. Inc.
- Current Assignee: GlobalFoundries U.S. Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Thompson Hine LLP
- Agent Anthony Canale
- Main IPC: G02B6/30
- IPC: G02B6/30 ; G02B6/42 ; F21V8/00 ; G02B6/12

Abstract:
Structures including an edge coupler and methods of forming a structure including an edge coupler. The structure includes a waveguide core over a dielectric layer and a back-end-of-line stack over the dielectric layer and the waveguide core. The back-end-of-line stack includes a side edge and a truncated layer that is overlapped with a tapered section of the waveguide core. The truncated layer has a first end surface adjacent to the side edge and a second end surface above the tapered section of the waveguide core. The truncated layer is tapered from the first end surface to the second end surface.
Public/Granted literature
- US20220229250A1 EDGE COUPLERS IN THE BACK-END-OF-LINE STACK OF A PHOTONICS CHIP Public/Granted day:2022-07-21
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