Invention Grant
- Patent Title: Optoelectronic modules having locking assemblies and methods for manufacturing the same
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Application No.: US16762102Application Date: 2018-10-25
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Publication No.: US11662541B2Publication Date: 2023-05-30
- Inventor: Bojan Tesanovic , Mario Cesana , Camilla Camarri , Hartmut Rudmann
- Applicant: ams Sensors Singapore Pte. Ltd.
- Applicant Address: SG Singapore
- Assignee: AMS Sensors Singapore PTE. Ltd.
- Current Assignee: AMS Sensors Singapore PTE. Ltd.
- Current Assignee Address: SG Singapore
- Agency: Kilpatrick Townsend & Stockton LLP
- International Application: PCT/SG2018/050540 2018.10.25
- International Announcement: WO2019/093965A 2019.05.16
- Date entered country: 2020-05-06
- Main IPC: H01L33/48
- IPC: H01L33/48 ; G02B7/02 ; H01L23/04 ; H01L23/31

Abstract:
This disclosure describes optoelectronic modules with locking assemblies and methods for manufacturing the same. The locking assemblies, in some instances, can improve mounting steps during manufacturing and can increase the useful lifetime of the optoelectronic modules into which they are incorporated. The locking assemblies can include overmold protrusions, and optical element housing protrusions, as well as locking edges incorporated into overmold housing components.
Information query
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