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公开(公告)号：US20200045828A1
公开(公告)日：2020-02-06
申请号：US16597447
申请日：2019-10-09
Applicant: ams Sensors Singapore Pte. Ltd.
Inventor： Bojan Tesanovic , Nicola Spring , Simon Gubser , Robert Lenart , Mario Cesana
IPC: H05K3/00 , H01L27/146 , H01L33/48 , H05K1/02
Abstract: Molded circuit substrates include a conductive layer surrounded by an insulating sidewall. The insulating sidewall further provides a structural component for an electronic module into which the molded circuit substrate is incorporated. Accordingly, the molded circuit substrates can permit better performance, reduce electronic module thickness, and reduce fabrication costs. Methods for fabricating molded circuit substrates can facilitate precise positioning of insulating sidewalls, insulating partitions, electrical contacts and other components.
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公开(公告)号：US12005658B2
公开(公告)日：2024-06-11
申请号：US17436823
申请日：2020-03-12
Applicant: ams Sensors Singapore Pte. Ltd.
Inventor： Bojan Tesanovic , Hartmut Rudmann , Nicola Spring , Sebastiano Lazzi Gazzini
IPC: B29D11/00 , B29C43/02 , B29C43/38 , B29C64/112 , B29C64/188 , B29C64/30 , B29C64/379 , G02B3/00 , B29L11/00
CPC classification number: B29D11/00307 , B29C43/021 , B29C43/38 , B29C64/112 , B29C64/188 , B29C64/30 , B29C64/379 , B29D11/00298 , B29D11/00365 , B29D11/00413 , G02B3/0075 , B29L2011/0016
Abstract: A method of manufacturing a plurality of optical elements (140) comprising the steps of providing a substrate (120), and a tool (101) comprising a plurality of replication sections (106), each defining a surface structure of one of the optical elements (140), the tool (101) further comprising at least one contact spacer portion (112), aligning the tool (101) and the substrate (120) with respect to each other and bringing the tool (101) and a first side of the substrate (122) together, with replication material (124) between the tool (101) and the substrate (120), the contact spacer portion (112) contacting the first side of the substrate (122), and thereby causing the spacer portion (112) to adhere to the first side of the substrate (122), hardening the replication material (124), wherein the substrate (120) has yard line features (138) around at least a portion of the replication sections (106), the yard line features (138) containing the replication material (124) on a first side of the yard line with respect to the tool (101) and the substrate (120).
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3.发明申请公开(公告)号：US20190214533A1
公开(公告)日：2019-07-11
申请号：US16275422
申请日：2019-02-14
Applicant: ams Sensors Singapore Pte. Ltd.
Inventor： Hartmut Rudmann , Qichuan Yu , Simon Gubser , Bojan Tesanovic , Xu Yi , Eunice Ho Hui Ong , Hongyuan Liu , Ji Wang , Edmund Koon Tian Lua , Myo Paing , Jian Tang , Ming Jie Lee
IPC: H01L33/48 , H01L25/16 , H01L33/62 , H01L33/54 , H01L31/0232 , H01L31/0203 , H01L31/02 , H01L33/58
CPC classification number: H01L33/486 , H01L25/167 , H01L31/02005 , H01L31/0203 , H01L31/02325 , H01L33/54 , H01L33/58 , H01L33/62 , H01L2224/48091 , H01L2224/73265 , H01L2924/16195 , H01L2933/0033 , H01L2933/005 , H01L2933/0058 , H01L2933/0066 , H01L2924/00014
Abstract: The present disclosure describes wafer-level processes for fabricating optoelectronic device subassemblies that can be mounted, for example, to a circuit substrate, such as a flexible cable or printed circuit board, and integrated into optoelectronic modules that include one or more optical subassemblies stacked over the optoelectronic device subassembly. The optoelectronic device subassembly can be mounted onto the circuit substrate using solder reflow technology even if the optical subassemblies are composed of materials that are not reflow compatible.
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公开(公告)号：US20220176597A1
公开(公告)日：2022-06-09
申请号：US17436823
申请日：2020-03-12
Applicant: ams Sensors Singapore Pte. Ltd.
Inventor： Bojan Tesanovic , Hartmut Rudmann , Nicola Spring , Sebastiano Lazzi Gazzini
IPC: B29C43/02 , B29C43/38 , B29C64/112 , B29C64/379 , B29D11/00
Abstract: A method of manufacturing a plurality of optical elements (140) comprising the steps of providing a substrate (120), and a tool (101) comprising a plurality of replication sections (106), each defining a surface structure of one of the optical elements (140), the tool (101) further comprising at least one contact spacer portion (112), aligning the tool (101) and the substrate (120) with respect to each other and bringing the tool (101) and a first side of the substrate (122) together, with replication material (124) between the tool (101) and the substrate (120), the contact spacer portion (112) contacting the first side of the substrate (122), and thereby causing the spacer portion (112) to adhere to the first side of the substrate (122), hardening the replication material (124), wherein the substrate (120) has yard line features (138) around at least a portion of the replication sections (106), the yard line features (138) containing the replication material (124) on a first side of the yard line with respect to the tool (101) and the substrate (120).
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公开(公告)号：US10527762B2
公开(公告)日：2020-01-07
申请号：US15441515
申请日：2017-02-24
Applicant: ams Sensors Singapore Pte. Ltd.
Inventor： Hartmut Rudmann , Susanne Westenhöfer , Bojan Tesanovic
Abstract: A device comprises at least one optics member (O) comprising at least one transparent portion (t) and at least one blocking portion (b). The at least one transparent portion (t) is made of one or more materials substantially transparent for light of at least a specific spectral range, referred to as transparent materials, and the at least one blocking portion (b) is made of one or more materials substantially non-transparent for light of the specific spectral range, referred to as non-transparent materials. The transparent portion (t) comprises at least one passive optical component (L). The at least one passive optical component (L) comprises a transparent element (6) having two opposing approximately flat surfaces substantially perpendicular to a vertical direction in a distance approximately equal to a thickness of the at least one blocking portion (b) measured along the vertical direction, and, attached to the transparent element (6), at least one optical structure (5).
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Patent Agency Ranking
公开(公告)号：US11662541B2
公开(公告)日：2023-05-30
申请号：US16762102
申请日：2018-10-25
Applicant: ams Sensors Singapore Pte. Ltd.
Inventor： Bojan Tesanovic , Mario Cesana , Camilla Camarri , Hartmut Rudmann
CPC classification number: G02B7/02 , H01L23/04 , H01L23/3121 , H01L23/3142 , H01L33/483
Abstract: This disclosure describes optoelectronic modules with locking assemblies and methods for manufacturing the same. The locking assemblies, in some instances, can improve mounting steps during manufacturing and can increase the useful lifetime of the optoelectronic modules into which they are incorporated. The locking assemblies can include overmold protrusions, and optical element housing protrusions, as well as locking edges incorporated into overmold housing components.
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公开(公告)号：US11013123B2
公开(公告)日：2021-05-18
申请号：US16597447
申请日：2019-10-09
Applicant: ams Sensors Singapore Pte. Ltd.
Inventor： Bojan Tesanovic , Nicola Spring , Simon Gubser , Robert Lenart , Mario Cesana
Abstract: Molded circuit substrates include a conductive layer surrounded by an insulating sidewall. The insulating sidewall further provides a structural component for an electronic module into which the molded circuit substrate is incorporated. Accordingly, the molded circuit substrates can permit better performance, reduce electronic module thickness, and reduce fabrication costs. Methods for fabricating molded circuit substrates can facilitate precise positioning of insulating sidewalls, insulating partitions, electrical contacts and other components.
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公开(公告)号：US10510932B2
公开(公告)日：2019-12-17
申请号：US16275422
申请日：2019-02-14
Applicant: ams Sensors Singapore Pte. Ltd.
Inventor： Hartmut Rudmann , Qichuan Yu , Simon Gubser , Bojan Tesanovic , Xu Yi , Eunice Ho Hui Ong , Hongyuan Liu , Ji Wang , Edmund Koon Tian Lua , Myo Paing , Jian Tang , Ming Jie Lee
IPC: H01L33/48 , H01L25/16 , H01L31/02 , H01L31/0203 , H01L31/0232 , H01L33/54 , H01L33/58 , H01L33/62
Abstract: The present disclosure describes wafer-level processes for fabricating optoelectronic device subassemblies that can be mounted, for example, to a circuit substrate, such as a flexible cable or printed circuit board, and integrated into optoelectronic modules that include one or more optical subassemblies stacked over the optoelectronic device subassembly. The optoelectronic device subassembly can be mounted onto the circuit substrate using solder reflow technology even if the optical subassemblies are composed of materials that are not reflow compatible.
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公开(公告)号：US20220190186A1
公开(公告)日：2022-06-16
申请号：US17437607
申请日：2020-03-27
Applicant: ams Sensors Singapore Pte. Ltd.
Inventor： Bojan Tesanovic , Ji Wang , QiChuan Yu , Alexander Bietsch
IPC: H01L31/12 , H01L33/58 , H01L31/0232 , H01L33/48 , H01L31/0203 , H01L31/18
Abstract: We disclose an optoelectronic module comprising an optoelectronic device operable to emit or detect a wavelength of radiation, an optical element arranged on the optoelectronic device, the optical element being transparent to the wavelength of radiation capable of being emitted or detected by the optoelectronic device, and a wall configured to laterally enclose the optoelectronic device and the optical element, the wall being opaque to the wavelength of radiation capable of being emitted or detected by the optoelectronic device.
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10.发明授权公开(公告)号：US11296270B2
公开(公告)日：2022-04-05
申请号：US16957185
申请日：2018-12-26
Applicant: ams Sensors Singapore Pte. Ltd.
Inventor： Bojan Tesanovic , Nicola Spring
IPC: H01L33/62 , H01L31/02 , H01L31/0203 , H01L31/0232 , H01L33/54 , H01L33/58 , H01S5/02 , H01S5/02216 , H01S5/02325
Abstract: Optoelectronic modules exhibiting relatively small thickness and methods for their manufacture are disclosed. The optoelectronic modules include substrates and transparent covers. Each optoelectronic module includes a transparent substrate on which an optoelectronic component is mounted. The optoelectronic component can be sensitive to and/or operable to generate a particular wavelength of electromagnetic radiation. The transparent substrate is transmissive to the particular wavelength of electromagnetic radiation. In some instances, the transparent substrate is composed, at least partially of glass.
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