Invention Grant
- Patent Title: Sub-field control of a lithographic process and associated apparatus
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Application No.: US17441353Application Date: 2020-03-05
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Publication No.: US11662666B2Publication Date: 2023-05-30
- Inventor: Rowin Meijerink , Putra Saputra , Pieter Gerardus Jacobus Smorenberg , Theo Wilhelmus Maria Thijssen , Khalid Elbattay , Ma Su Su Hlaing , Paul Derwin , Bo Zhong , Masaya Komatsu
- Applicant: ASML NETHERLANDS B.V.
- Applicant Address: NL Veldhoven
- Assignee: ASML NETHERLANDS B.V.
- Current Assignee: ASML NETHERLANDS B.V.
- Current Assignee Address: NL Veldhoven
- Agency: Pillsbury Winthrop Shaw Pittman, LLP
- Priority: EP 167211 2019.04.04 EP 172479 2019.05.03 EP 177106 2019.05.28 EP 192433 2019.08.20
- International Application: PCT/EP2020/055890 2020.03.05
- International Announcement: WO2020/200635A 2020.10.08
- Date entered country: 2021-09-21
- Main IPC: G03F7/20
- IPC: G03F7/20

Abstract:
A method for controlling a lithographic apparatus configured to pattern an exposure field on a substrate including at least a sub-field, the method including: obtaining an initial spatial profile associated with a spatial variation of a performance parameter associated with a layer on the substrate across at least the sub-field of the exposure field; and decomposing the initial spatial profile into at least a first component spatial profile for controlling a lithographic apparatus at a first spatial scale and a second component spatial profile for controlling the lithographic apparatus at a second spatial scale associated with a size of the sub-field, wherein the decomposing includes co-optimizing the first and second component spatial profiles based on correcting the spatial variation of the performance parameter across the sub-field.
Public/Granted literature
- US20220171295A1 SUB-FIELD CONTROL OF A LITHOGRAPHIC PROCESS AND ASSOCIATED APPARATUS Public/Granted day:2022-06-02
Information query
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