Invention Grant
- Patent Title: High-frequency power circuit, plasma treatment apparatus, and plasma treatment method
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Application No.: US17634208Application Date: 2021-08-24
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Publication No.: US11665809B2Publication Date: 2023-05-30
- Inventor: Kenta Doi , Toshiyuki Nakamura
- Applicant: ULVAC, INC.
- Applicant Address: JP Chigasaki
- Assignee: ULVAC, INC.
- Current Assignee: ULVAC, INC.
- Current Assignee Address: JP Chigaski
- Agency: Schwegman Lundberg & Woessner, P.A.
- Priority: JP 2020193677 2020.11.20
- International Application: PCT/JP2021/030948 2021.08.24
- International Announcement: WO2022/107407A 2022.05.27
- Date entered country: 2022-02-09
- Main IPC: H05H1/46
- IPC: H05H1/46 ; H01J37/16 ; H01J37/244 ; H01Q1/26

Abstract:
A high-frequency power circuit includes a first antenna circuit and a second antenna circuit that are connected in parallel to a matching box connected to a high-frequency power supply. The first antenna circuit include a first antenna, a first distribution capacitor, and a first variable capacitor. The second antenna circuit includes a second antenna, a second distribution capacitor, and a second variable capacitor. A controller sets a capacitance of the first variable capacitor based on a detection result of a phase difference between current and voltage in a series-connected portion of the first antenna and the first variable capacitor during plasma production to reduce this phase difference and sets a capacitance of the second variable capacitor based on a detection result of a phase difference between current and voltage in a series-connected portion of the second antenna and the second variable capacitor during plasma production to reduce this phase difference.
Public/Granted literature
- US20220377870A1 HIGH-FREQUENCY POWER CIRCUIT, PLASMA TREATMENT APPARATUS, AND PLASMA TREATMENT METHOD Public/Granted day:2022-11-24
Information query
IPC分类: