公开(公告)号：US12217969B2

公开(公告)日：2025-02-04

申请号：US17393208

申请日：2021-08-03

Applicant: ULVAC, Inc.

Inventor： Kenta Doi ,  Toshiyuki Sakuishi ,  Toshiyuki Nakamura ,  Yasuhiro Morikawa

IPC: H01L21/3065 ,  H01J37/32 ,  H01L21/308

Abstract: A silicon dry etching method of the invention, includes: preparing a silicon substrate; forming a mask pattern having an opening on the silicon substrate; forming a deposition layer on the silicon substrate in accordance with the mask pattern while introducing a first gas; carrying out a dry etching process with respect to the silicon substrate in accordance with the mask pattern while introducing a second gas, and thereby forming a recess pattern on a surface of the silicon substrate; and carrying out an ashing process with respect to the silicon substrate while introducing a third gas.

公开(公告)号：US12205795B2

公开(公告)日：2025-01-21

申请号：US17829144

申请日：2022-05-31

Applicant: ULVAC, INC.

Inventor： Taichi Suzuki ,  Yasuhiro Morikawa ,  Kenta Doi ,  Toshiyuki Nakamura

IPC: H01J37/32

Abstract: A plasma processing device includes an inductively coupled plasma antenna including an input end and an output end, a series circuit including an additional inductor and a variable capacitor connected in series, and a controller that varies a capacitance of the variable capacitor. The input terminal is connected via an antenna matching device to an antenna power supply. The output terminal is connected to the additional inductor. The additional inductor is connected via the variable capacitor to ground.

公开(公告)号：US20230290623A1

公开(公告)日：2023-09-14

申请号：US18118559

申请日：2023-03-07

Applicant: ULVAC, INC.

Inventor： Kenta Doi ,  Toshiyuki Nakamura

IPC: H01J37/32

CPC classification number: H01J37/32935 ,  H01J37/32146 ,  H01J2237/24564 ,  H01J2237/334 ,  H01J37/32192 ,  H01J2237/24585

Abstract: A method for processing a subject with plasma includes repeatedly outputting first pulses from a pulse generator to a first high-frequency power supply, intermittently outputting first high-frequency power from the first high-frequency power supply to a first electrode based on the first pulses to generate the plasma, detecting start of plasma generation caused by a present first pulse with a detector, calculating a delay period, being from rise of the present first pulse until the detector detects start of plasma generation, repeatedly outputting second pulses from the pulse generator to a second high-frequency power supply based on time at which the delay period has elapsed from rise of a first pulse output after the delay period is calculated, and outputting second high-frequency power from the second high-frequency power supply to a second electrode based on the second pulses to draw ions from the plasma to the subject.

公开(公告)号：US11665809B2

公开(公告)日：2023-05-30

申请号：US17634208

申请日：2021-08-24

Applicant: ULVAC, INC.

Inventor： Kenta Doi ,  Toshiyuki Nakamura

IPC: H05H1/46 ,  H01J37/16 ,  H01J37/244 ,  H01Q1/26

CPC classification number: H05H1/46 ,  H01J37/16 ,  H01J37/244 ,  H01Q1/26

Abstract: A high-frequency power circuit includes a first antenna circuit and a second antenna circuit that are connected in parallel to a matching box connected to a high-frequency power supply. The first antenna circuit include a first antenna, a first distribution capacitor, and a first variable capacitor. The second antenna circuit includes a second antenna, a second distribution capacitor, and a second variable capacitor. A controller sets a capacitance of the first variable capacitor based on a detection result of a phase difference between current and voltage in a series-connected portion of the first antenna and the first variable capacitor during plasma production to reduce this phase difference and sets a capacitance of the second variable capacitor based on a detection result of a phase difference between current and voltage in a series-connected portion of the second antenna and the second variable capacitor during plasma production to reduce this phase difference.

公开(公告)号：US12020942B2

公开(公告)日：2024-06-25

申请号：US17728524

申请日：2022-04-25

Applicant: ULVAC, Inc.

Inventor： Taichi Suzuki ,  Yasuhiro Morikawa ,  Kenta Doi ,  Toshiyuki Nakamura

IPC: H01L21/3065 ,  B81C1/00 ,  C23C14/02 ,  C23C14/34 ,  H01J37/32 ,  H01L21/308 ,  H01L21/311

CPC classification number: H01L21/30655 ,  B81C1/00531 ,  B81C1/00619 ,  C23C14/021 ,  C23C14/34 ,  H01J37/321 ,  H01J37/3244 ,  H01J37/32541 ,  H01J37/32568 ,  H01L21/3065 ,  H01L21/308 ,  H01L21/3086 ,  H01L21/31116 ,  H01L21/31138 ,  H01L21/31144 ,  B81C2201/0112 ,  B81C2201/0132 ,  B81C2201/014 ,  H01J2237/3321 ,  H01J2237/3341 ,  H01J2237/3342

Abstract: An etching method of the invention includes: a resist pattern-forming step of forming a resist layer on a target object, the resist layer being formed of a resin, the resist layer having a resist pattern; an etching step of etching the target object via the resist layer having the resist pattern; and a resist protective film-forming step of forming a resist protective film on the resist layer. The etching step is repetitively carried out multiple times. After the etching steps are repetitively carried out multiple times, the resist protective film-forming step is carried out.

公开(公告)号：US20220392746A1

公开(公告)日：2022-12-08

申请号：US17829144

申请日：2022-05-31

Applicant: ULVAC, INC.

Inventor： Taichi Suzuki ,  Yasuhiro Morikawa ,  Kenta Doi ,  Toshiyuki Nakamura

IPC: H01J37/32

Abstract: A plasma processing device includes an inductively coupled plasma antenna including an input end and an output end, a series circuit including an additional inductor and a variable capacitor connected in series, and a controller that varies a capacitance of the variable capacitor. The input terminal is connected via an antenna matching device to an antenna power supply. The output terminal is connected to the additional inductor. The additional inductor is connected via the variable capacitor to ground.

公开(公告)号：US20220377870A1

公开(公告)日：2022-11-24

申请号：US17634208

申请日：2021-08-24

Applicant: ULVAC, INC.

Inventor： Kenta Doi ,  Toshiyuki Nakamura

IPC: H05H1/46 ,  H01J37/16 ,  H01J37/244 ,  H01Q1/26

Abstract: A high-frequency power circuit includes a first antenna circuit and a second antenna circuit that are connected in parallel to a matching box connected to a high-frequency power supply. The first antenna circuit include a first antenna, a first distribution capacitor, and a first variable capacitor. The second antenna circuit includes a second antenna, a second distribution capacitor, and a second variable capacitor. A controller sets a capacitance of the first variable capacitor based on a detection result of a phase difference between current and voltage in a series-connected portion of the first antenna and the first variable capacitor during plasma production to reduce this phase difference and sets a capacitance of the second variable capacitor based on a detection result of a phase difference between current and voltage in a series-connected portion of the second antenna and the second variable capacitor during plasma production to reduce this phase difference.