Invention Grant
- Patent Title: Laser and photonic chip integration
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Application No.: US17454918Application Date: 2021-11-15
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Publication No.: US11668886B2Publication Date: 2023-06-06
- Inventor: Jock T. Bovington
- Applicant: Cisco Technology, Inc.
- Applicant Address: US CA San Jose
- Assignee: Cisco Technology, Inc.
- Current Assignee: Cisco Technology, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Patterson + Sheridan, LLP
- Main IPC: G02B6/42
- IPC: G02B6/42 ; G02B6/12

Abstract:
Embodiments herein describe optical assemblies that use a spacer element to attach and align a laser to a waveguide in a photonic chip. Once aligned, the laser can transfer optical signals into the photonic chip which can then perform an optical function such as modulation, filtering, amplification, and the like. In one embodiment, the spacer element is a separate part (e.g., a glass or semiconductor block) that is attached between the photonic chip and a submount on which the laser is mounted. The spacer establishes a separation distance between the photonic chip and the submount which in turn aligns the laser with the waveguide in the photonic chip. In another embodiment, rather than the spacer element being a separate part, the spacer element may be integrated into the submount.
Public/Granted literature
- US20220075131A1 LASER AND PHOTONIC CHIP INTEGRATION Public/Granted day:2022-03-10
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