A panel-shaped metal wall grids array for panel level IC packaging and associated manufacturing method. Each metal wall grid in the metal wall grids array has a continuous and closed metal wall of a predetermined wall height. The metal wall grids are connected to form a monolithic panel through a plurality of metal connecting portions. When the panel-shaped metal wall grids array is used for panel level IC packaging, at least one IC chip/IC die is disposed in each metal wall grid with a top surface of each IC chip/IC die facing downwards, and a panel-shaped metal layer matching with the panel-shaped wall grids array may be further formed on the entire back side of the panel-shaped metal wall grids array so that the panel-shaped metal layer is bonded to the metal wall of each metal wall grid.