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    PANEL LEVEL METAL WALL GRIDS ARRAY FOR INTEGRATED CIRCUIT PACKAGING AND ASSOCIATED MANUFACTURING METHOD
    2.
    发明申请
    PANEL LEVEL METAL WALL GRIDS ARRAY FOR INTEGRATED CIRCUIT PACKAGING AND ASSOCIATED MANUFACTURING METHOD 有权

    公开(公告)号：US20220077075A1

    公开(公告)日：2022-03-10

    申请号：US17469822

    申请日：2021-09-08

    Applicant: Chengdu Monolithic Power Systems Co., Ltd.

    Inventor： Yingjiang Pu ,  Hunt Hang Jiang ,  Xiuhong Guo

    IPC: H01L23/552 ,  C25D5/02 ,  H01L23/373 ,  H01L21/48

    Abstract: A panel-shaped metal wall grids array for panel level IC packaging and associated manufacturing method. Each metal wall grid in the metal wall grids array has a continuous and closed metal wall of a predetermined wall height. The metal wall grids are connected to form a monolithic panel through a plurality of metal connecting portions. When the panel-shaped metal wall grids array is used for panel level IC packaging, at least one IC chip/IC die is disposed in each metal wall grid with a top surface of each IC chip/IC die facing downwards, and a panel-shaped metal layer matching with the panel-shaped wall grids array may be further formed on the entire back side of the panel-shaped metal wall grids array so that the panel-shaped metal layer is bonded to the metal wall of each metal wall grid,

    Flip chip package unit and associated packaging method
    3.
    发明授权
    Flip chip package unit and associated packaging method 有权

    公开(公告)号：US12266583B2

    公开(公告)日：2025-04-01

    申请号：US17712323

    申请日：2022-04-04

    Applicant: Chengdu Monolithic Power Systems Co., Ltd.

    Inventor： Yingjiang Pu ,  Hunt Hang Jiang ,  Xiuhong Guo

    IPC: H01L21/683 ,  H01L23/00 ,  H01L23/31 ,  H01L23/29

    Abstract: A flip chip package unit and associated packaging method. The flip chip package unit may include an integrated circuit (“IC”) die having a plurality of metal pillars formed on its first surface and attached to a rewiring substrate with the first surface of the IC die facing to the rewiring substrate, an under-fill material filling gaps between the first surface of the IC die and the rewiring substrate, and a back protective film attached to a second surface of the IC die. The back protective film may have good UV sensitivity to change from non-solid to solid after UV irradiation while maintaining its viscosity with the IC die not reduced after UV irradiation. The back protective film may be uneasy to deform and to peel off from the IC die and can provide physical protection and effective heat dissipation path to the IC die.

    FLIP CHIP PACKAGE UNIT AND ASSOCIATED PACKAGING METHOD
    6.
    发明申请
    FLIP CHIP PACKAGE UNIT AND ASSOCIATED PACKAGING METHOD 有权

    公开(公告)号：US20220344175A1

    公开(公告)日：2022-10-27

    申请号：US17717257

    申请日：2022-04-11

    Applicant: Chengdu Monolithic Power Systems Co., Ltd.

    Inventor： Yingjiang Pu ,  Hunt Hang Jiang ,  Xiuhong Guo

    IPC: H01L21/56 ,  H01L23/552 ,  H01L23/367 ,  H01L23/00 ,  H01L23/31

    Abstract: A flip chip package unit and associated packaging method. The flip chip package unit may include an integrated circuit (“IC”) die having a plurality of metal pillars formed on its first surface and attached to a rewiring substrate with the first surface of the IC die facing to the rewiring substrate, an under-fill material filling gaps between the first surface of the IC die and the rewiring substrate, and a thermal conductive protection film covering or overlaying and directly contacting with the entire second die surface and a first portion of sidewalls of the IC die. The thermal conductive protection film may have good thermal conductivity, uneasy to fall off from the IC die and can provide physical protection, electromagnetic interference protection and effective heat dissipation path to the IC die.

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