Invention Grant
- Patent Title: Thermoelectric element assembly, method for manufacturing the same, and thermoelectric module comprising the same
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Application No.: US17388012Application Date: 2021-07-29
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Publication No.: US11672178B2Publication Date: 2023-06-06
- Inventor: Sang Ii Kim
- Applicant: UNIVERSITY OF SEOUL INDUSTRY COOPERATION FOUNDATION
- Applicant Address: KR Seoul
- Assignee: UNIVERSITY OF SEOUL INDUSTRY COOPERATION FOUNDATION
- Current Assignee: UNIVERSITY OF SEOUL INDUSTRY COOPERATION FOUNDATION
- Current Assignee Address: KR Seoul
- Agency: Cantor Colburn LLP
- Priority: KR 20200097487 2020.08.04
- Main IPC: H01L35/32
- IPC: H01L35/32 ; H01L35/34 ; H01L35/16
Abstract:
Provided is a thermoelectric element assembly including a soft support including a plurality of through-holes, and a plurality of p-type thermoelectric elements and a plurality of n-type thermoelectric elements inserted into a plurality of through-holes of the support, wherein a thickness of the support is less than a length of the thermoelectric element.
Information query
IPC分类:
