- 专利标题: Composition for forming resist overlayer film for EUV lithography
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申请号: US13880470申请日: 2011-09-15
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公开(公告)号: US11675269B2公开(公告)日: 2023-06-13
- 发明人: Rikimaru Sakamoto , Bangching Ho , Takafumi Endo
- 申请人: Rikimaru Sakamoto , Bangching Ho , Takafumi Endo
- 申请人地址: JP Toyama
- 专利权人: NISSAN CHEMICAL INDUSTRIES, LTD.
- 当前专利权人: NISSAN CHEMICAL INDUSTRIES, LTD.
- 当前专利权人地址: JP Tokyo
- 代理机构: Oliff PLC
- 优先权: JP 2010236121 2010.10.21
- 国际申请: PCT/JP2011/071139 2011.09.15
- 国际公布: WO2012/053302A 2012.04.26
- 进入国家日期: 2013-04-19
- 主分类号: G03F7/11
- IPC分类号: G03F7/11 ; C08L61/06 ; C08G8/08 ; C09D161/06 ; G03F7/09 ; C08G8/24 ; C09D5/00 ; C08F12/24 ; C08F212/14
摘要:
There is provided a composition for forming an EUV resist overlayer film that is used in an EUV lithography process, that does not intermix with the EUV resist, that blocks unfavorable exposure light for EUV exposure, for example, UV light and DUV light and selectively transmits EUV light alone, and that can be developed with a developer after exposure. A composition for forming an EUV resist overlayer film used in an EUV lithography process including a resin containing a naphthalene ring in a main chain or in a side chain and a solvent, in which the resin may include a hydroxy group, a carboxy group, a sulfo group, or a monovalent organic group having at least one of these groups as a hydrophilic group.
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