Invention Grant
- Patent Title: Snap rivets for securing printed circuit board assemblies
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Application No.: US17410650Application Date: 2021-08-24
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Publication No.: US11675398B2Publication Date: 2023-06-13
- Inventor: Chun Chang , Kai-Yuan Chuang , Wei-Pin Chen , Jyue Hou
- Applicant: QUANTA COMPUTER INC.
- Applicant Address: TW Taoyuan
- Assignee: QUANTA COMPUTER INC.
- Current Assignee: QUANTA COMPUTER INC.
- Current Assignee Address: TW Taoyuan
- Agency: Nixon Peabody LLP
- Main IPC: G06F1/18
- IPC: G06F1/18 ; F16B19/08

Abstract:
A system includes a computing system, a snap rivet, and a printed circuit board assembly (PCBA). The computing system includes a chassis. The snap rivet includes a rivet and a cap, and the cap is secured to the chassis. The PCBA includes a pin base. The pin base has a washer portion with a hole. The pin base is configured to receive the cap through the hole. The cap protrudes through the hole and mechanically engages the rivet to secure the PCBA to the chassis. The snap rivet provides for tool-less installation and removal of the PCBA from the chassis of the computing system.
Public/Granted literature
- US20230060228A1 SNAP RIVETS FOR SECURING PRINTED CIRCUIT BOARD ASSEMBLIES Public/Granted day:2023-03-02
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