Invention Grant
- Patent Title: Semiconductor package having a chip carrier and a metal plate sized independently of the chip carrier
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Application No.: US17034109Application Date: 2020-09-28
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Publication No.: US11676879B2Publication Date: 2023-06-13
- Inventor: Stefan Woetzel , Chee Yang Ng
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Main IPC: H01L23/367
- IPC: H01L23/367 ; H01L21/48 ; H01L21/56 ; H01L21/78 ; H01L23/29 ; H01L23/31 ; H01L23/495 ; H01L23/498 ; H01L23/00
Abstract:
A semiconductor package includes: a carrier having a first side and a second side opposite the first side, the first side having a plurality of contact structures; a semiconductor die having a first side and a second side opposite the first side, the first side of the semiconductor die having a plurality of pads attached to the plurality of contact structures at the first side of the carrier; a metal plate attached to the second side of the semiconductor die, the metal plate having a size that is independent of the size of the carrier and based on an expected thermal load to be presented by the semiconductor die; and an encapsulant confined by the carrier and the metal plate and laterally surrounding an edge of the semiconductor die. Corresponding methods of production are also provided.
Public/Granted literature
- US20220102235A1 SEMICONDUCTOR PACKAGE HAVING A CHIP CARRIER AND A METAL PLATE SIZED INDEPENDENTLY OF THE CHIP CARRIER Public/Granted day:2022-03-31
Information query
IPC分类:
