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    Hybrid Embedded Package
    6.
    发明申请
    Hybrid Embedded Package 有权

    公开(公告)号：US20230052437A1

    公开(公告)日：2023-02-16

    申请号：US17973920

    申请日：2022-10-26

    Applicant: Infineon Technologies AG

    Inventor： Stefan Woetzel ,  Chee Yang Ng

    IPC: H01L23/31 ,  H01L23/538

    Abstract: A method of producing a semiconductor package includes providing a substrate formed of electrically insulating material and including a die mounting surface, and a first semiconductor die embedded within the substrate, the first semiconductor die including a first conductive terminal that faces the die mounting surface, providing a second semiconductor die that includes a first conductive terminal, and mounting the second semiconductor die on the die mounting surface such that the first conductive terminal of the second semiconductor die faces and is spaced apart from the die mounting surface, a first electrical connection that directly connects the first conductive terminals of the first and second semiconductor dies together is formed, and the second semiconductor die partially overlaps with the first semiconductor die.

    PACKAGE WITH ACOUSTIC SENSING DEVICE(S) AND MILLIMETER WAVE SENSING ELEMENTS
    7.
    发明申请
    PACKAGE WITH ACOUSTIC SENSING DEVICE(S) AND MILLIMETER WAVE SENSING ELEMENTS 审中-公开

    公开(公告)号：US20200154183A1

    公开(公告)日：2020-05-14

    申请号：US16682468

    申请日：2019-11-13

    Applicant: Infineon Technologies AG

    Inventor： Kok Yau Chua ,  Chee Yang Ng

    IPC: H04R1/02 ,  H04R3/00 ,  G10L15/22 ,  H04R31/00 ,  G01S13/86

    Abstract: In accordance with an embodiment a package includes: a package structure which defines inner surfaces delimiting an inner volume and outer surfaces directed towards an exterior of the package; at least one acoustic sensor element applied to at least one of the inner surfaces, to convert acoustic waves arriving from the exterior of the package into acoustic information in the form of electric signals; a plurality of millimeter wave sensing elements applied to at least one of the outer surfaces, to receive reflected radar signals from objects in the exterior of the package; and a circuitry applied to at least one of the inner surfaces of the package structure, wherein the circuitry is electrically connected to the at least one acoustic sensor element and the plurality of millimeter wave sensing elements to process the acoustic information and the reflected radar signals.

    Semiconductor Package with Air Gap
    10.
    发明申请
    Semiconductor Package with Air Gap 审中-公开
    具有空气间隙的半导体封装

    公开(公告)号：US20150145078A1

    公开(公告)日：2015-05-28

    申请号：US14090019

    申请日：2013-11-26

    Applicant: Infineon Technologies AG

    Inventor： Chee Yang Ng

    IPC: B81B3/00 ,  B81C1/00

    CPC classification number: H01L23/315 ,  B81C1/00269 ,  B81C99/002 ,  B81C2203/0109 ,  H01L2224/16 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A semiconductor package includes a semiconductor die having a first main side and a second main side opposite the first main side, the first main side having an inner region surrounded by a periphery region. The semiconductor package further includes a film covering the semiconductor die and adhered to the periphery region of the first main side of the semiconductor die. The film has a curved surface so that the inner region of the first main side of the semiconductor die is spaced apart from the film by an air gap. Electrical conductors are attached at a first end to pads at the periphery region of the first main side of the semiconductor die. A corresponding method of manufacture is also provided.

    Abstract translation: 半导体封装包括具有第一主侧和与第一主侧相对的第二主侧的半导体管芯，第一主侧具有由周边区域包围的内部区域。 半导体封装还包括覆盖半导体管芯并粘附到半导体管芯的第一主侧的周边区域的膜。 薄膜具有弯曲表面，使得半导体管芯的第一主侧的内部区域与膜间隔开气隙。 电导体在第一端附接到半导体管芯的第一主侧的周边区域处的焊盘。 还提供了相应的制造方法。

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