- Patent Title: Semiconductor device package and method for manufacturing the same
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Application No.: US17133365Application Date: 2020-12-23
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Publication No.: US11676912B2Publication Date: 2023-06-13
- Inventor: Chia Hsiu Huang , Chun Chen Chen , Wei Chih Cho , Shao-Lun Yang
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee Address: TW Kaohsiung
- Agency: Foley & Lardner LLP
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/00 ; H01L23/31 ; H01L23/498 ; H01L21/48 ; H01L21/56
Abstract:
A semiconductor device package and a method for manufacturing a semiconductor device package are provided. The semiconductor device package includes a substrate, a clip, and a support structure. The clip is disposed on the substrate. The clip includes a first portion and a second portion separated from each other by a slit. The support structure is above the substrate and supports the clip. The support structure has a first surface and a second surface facing the first surface, and the first surface and the second surface define a gap.
Public/Granted literature
- US20220199552A1 SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2022-06-23
Information query
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