Invention Grant
- Patent Title: Sensor module with a collar
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Application No.: US17446895Application Date: 2021-09-03
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Publication No.: US11678043B2Publication Date: 2023-06-13
- Inventor: Russell Gruhlke , Jon Lasiter , Ravindra Vaman Shenoy , Ravishankar Sivalingam , Kebin Li , Khurshid Syed Alam
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Qualcomm Incorporated
- Main IPC: H04N5/225
- IPC: H04N5/225 ; H04N23/57 ; H04N23/60 ; H04M1/02

Abstract:
Various aspects of the present disclosure generally relate to a sensor module. In some aspects, a sensor module may include a collar configured to be attached to a camera module for a user device. The collar may include a first opening that is configured to align with an aperture of a camera of the camera module, and a second opening. The sensor module may include a sensor embedded in the collar. The sensor may be aligned with the second opening of the collar. Numerous other aspects are provided.
Public/Granted literature
- US20210400178A1 SENSOR MODULE FOR A USER DEVICE Public/Granted day:2021-12-23
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