Display device having improved bonding between display panel and encapsulation substrate and method of fabricating the same
Abstract:
A display device includes a display panel having a display area comprising pixels and a non-display area surrounding the display area, an encapsulation substrate which faces the display panel and is disposed on a surface of the display panel, and a sealing member disposed in the non-display area and interposed between the display panel and the encapsulation substrate for bonding. The display panel comprises a base substrate and a first conductive layer disposed on a first surface of the base substrate, the base substrate provides a through hole defined in a part of the non-display area to penetrate the base substrate in a thickness direction, the first conductive layer comprises a signal line disposed in a part of the non-display area and filling the through hole, and the sealing member does not overlap the first conductive layer and the through hole in the thickness direction.
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