Invention Grant
- Patent Title: Display device having improved bonding between display panel and encapsulation substrate and method of fabricating the same
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Application No.: US17012115Application Date: 2020-09-04
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Publication No.: US11678502B2Publication Date: 2023-06-13
- Inventor: Hyun A Lee , Kyung Rok Ko , Yong Hoon Kwon , Byung Hoon Kim , Jung Hyun Kim , Tae Oh Kim , June Hyoung Park , Hyun Ji Lee , So Mi Jung
- Applicant: Samsung Display Co., LTD.
- Applicant Address: KR Yongin-si
- Assignee: SAMSUNG DISPLAY CO., LTD.
- Current Assignee: SAMSUNG DISPLAY CO., LTD.
- Current Assignee Address: KR Gyenonggi-Do
- Agency: Cantor Colburn LLP
- Priority: KR 20200015461 2020.02.10
- Main IPC: H01L51/52
- IPC: H01L51/52 ; H01L27/32 ; H01L23/00

Abstract:
A display device includes a display panel having a display area comprising pixels and a non-display area surrounding the display area, an encapsulation substrate which faces the display panel and is disposed on a surface of the display panel, and a sealing member disposed in the non-display area and interposed between the display panel and the encapsulation substrate for bonding. The display panel comprises a base substrate and a first conductive layer disposed on a first surface of the base substrate, the base substrate provides a through hole defined in a part of the non-display area to penetrate the base substrate in a thickness direction, the first conductive layer comprises a signal line disposed in a part of the non-display area and filling the through hole, and the sealing member does not overlap the first conductive layer and the through hole in the thickness direction.
Public/Granted literature
- US20210249627A1 DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME Public/Granted day:2021-08-12
Information query
IPC分类: