Invention Grant
- Patent Title: Electronic device assembly
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Application No.: US17719315Application Date: 2022-04-12
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Publication No.: US11681329B2Publication Date: 2023-06-20
- Inventor: Yu-Shih Wang , Yi-Ta Huang , Chih-Chun Liu , Cheng-Nan Ling , Wen-Chieh Tai , Chi-Hung Lai , Wu-Chen Lee , Pin-Chueh Lin , Chih-Wei Liao , Ting-Wen Pai , Wen-Chieh Chen
- Applicant: Acer Incorporated
- Applicant Address: TW New Taipei
- Assignee: Acer Incorporated
- Current Assignee: Acer Incorporated
- Current Assignee Address: TW New Taipei
- Agency: JCIPRNET
- Priority: TW 9200733 2020.01.17
- The original application number of the division: US16905922 2020.06.19
- Main IPC: G06F1/16
- IPC: G06F1/16 ; H01R13/62 ; H01R13/26 ; H01R13/24

Abstract:
An electronic device assembly is provided, including an electronic device body and a detachable lens module. The electronic device body has a housing and a first joining unit, wherein the first joining unit is disposed on the housing. The detachable lens module is detachably assembled onto the housing and has a second joining unit, wherein the first joining unit is joined to the second joining unit to electrically connect the detachable lens module to the electronic device body.
Public/Granted literature
- US20220236766A1 ELECTRONIC DEVICE ASSEMBLY Public/Granted day:2022-07-28
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