- 专利标题： IC chip package with dummy solder structure under corner, and related method
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申请号： US17517091申请日： 2021-11-02
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公开(公告)号： US11682646B2公开(公告)日： 2023-06-20
- 发明人: Manish Nayini , Richard S. Graf , Janak G. Patel , Nazmul Habib
- 申请人： MARVELL ASIA PTE, LTD.
- 申请人地址： SG Singapore
- 专利权人： MARVELL ASIA PTE LTD.
- 当前专利权人： MARVELL ASIA PTE LTD.
- 当前专利权人地址： SG Singapore
- 主分类号： H01L29/40
- IPC分类号： H01L29/40 ; H01L21/00 ; H01L23/00 ; H01L23/498 ; H01L21/48 ; H01L21/56 ; B23K1/00 ; H01L23/31 ; B23K101/40
摘要：
An integrated circuit (IC) chip package includes a substrate and a wafer comprising an IC chip arranged on the substrate. The substrate includes first mounting pads unconnected to electrical connections in the substrate. The wafer includes second mounting pads that are disposed around corners of the IC chip, that extend radially outward relative to circuitry in the IC chip, that are unconnected to circuitry in the IC chip, and that mate with the first mounting pads on the substrate, respectively.
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