公开(公告)号：US20230035100A1

公开(公告)日：2023-02-02

申请号：US17874345

申请日：2022-07-27

申请人： Marvell Asia Pte Ltd

发明人： Janak G. Patel ,  Manish Nayini ,  Richard S. Graf ,  Nazmul Habib

IPC分类号： H01L23/367 ,  H01L23/373 ,  H01L25/065 ,  H01L23/60 ,  H01L21/48

摘要： An electronic device, including a substrate and a stack of dies stacked on the substrate. The stack of dies includes: (a) one or more functional dies, the functional dies including functional electronic circuits and being configured to exchange electrical signals at least with the substrate, and (b) one or more dummy dies, the dummy dies being disposed among dies forming the stack and being configured to: (i) dissipate heat generated by the one or more functional dies and (ii) pass electrical signals exchanged between the substrate and the one or more functional dies or between two or more of the functional dies.

公开(公告)号：US11810832B2

公开(公告)日：2023-11-07

申请号：US17360571

申请日：2021-06-28

申请人： Marvell Asia Pte, Ltd.

发明人： Janak Patel ,  Richard Graf ,  Manish Nayini ,  Nazmul Habib

IPC分类号： H01L23/367 ,  H01L21/48 ,  H01L23/498 ,  H01L25/065

CPC分类号： H01L23/367 ,  H01L21/4882 ,  H01L23/49816 ,  H01L23/49833 ,  H01L23/49838 ,  H01L25/0655

摘要： A multi-chip integrated circuit (IC) apparatus includes a substrate, one or more first IC chips mounted on the substrate, and a second IC chip mounted on the substrate. One or more first heat sinks are respectively thermally coupled to the one or more first IC chips. A second heat sink is thermally coupled to the second IC chip. An under side of the second heat sink is located further from the substrate than each of respective one or more top sides of the one or more first heat sinks.

公开(公告)号：US11682646B2

公开(公告)日：2023-06-20

申请号：US17517091

申请日：2021-11-02

申请人： MARVELL ASIA PTE, LTD.

发明人： Manish Nayini ,  Richard S. Graf ,  Janak G. Patel ,  Nazmul Habib

IPC分类号： H01L29/40 ,  H01L21/00 ,  H01L23/00 ,  H01L23/498 ,  H01L21/48 ,  H01L21/56 ,  B23K1/00 ,  H01L23/31 ,  B23K101/40

CPC分类号： H01L24/14 ,  B23K1/0008 ,  H01L21/4853 ,  H01L21/563 ,  H01L23/3157 ,  H01L23/49805 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  B23K2101/40 ,  H01L2224/13211 ,  H01L2224/13239 ,  H01L2224/13247 ,  H01L2224/1403 ,  H01L2224/14517 ,  H01L2224/16227 ,  H01L2224/81125 ,  H01L2224/81815 ,  H01L2924/014 ,  H01L2924/0105 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/15321 ,  H01L2924/18161 ,  H01L2924/35121

摘要： An integrated circuit (IC) chip package includes a substrate and a wafer comprising an IC chip arranged on the substrate. The substrate includes first mounting pads unconnected to electrical connections in the substrate. The wafer includes second mounting pads that are disposed around corners of the IC chip, that extend radially outward relative to circuitry in the IC chip, that are unconnected to circuitry in the IC chip, and that mate with the first mounting pads on the substrate, respectively.