Invention Grant
- Patent Title: Data accessing method using dynamic speed adjustment with aid of thermal control unit, and associated apparatus
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Application No.: US17149663Application Date: 2021-01-14
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Publication No.: US11687432B2Publication Date: 2023-06-27
- Inventor: Chun-Cheng Lee , Che-Min Lin , Kuan-Chun Yu , Sheng-I Hsu
- Applicant: Silicon Motion, Inc.
- Applicant Address: TW Hsinchu County
- Assignee: Silicon Motion, Inc.
- Current Assignee: Silicon Motion, Inc.
- Current Assignee Address: TW Hsinchu County
- Agent Winston Hsu
- Main IPC: G06F11/30
- IPC: G06F11/30 ; G06F13/16 ; G06F11/00 ; G06F12/02 ; G06F11/07

Abstract:
A data accessing method using dynamic speed adjustment with aid of a thermal control unit, and associated apparatus such as memory device, memory controller, etc. are provided. The data accessing method includes: utilizing a thermal control unit to start monitoring temperature at a predetermined intra-controller location of the memory controller; in response to at least one accessing request from a host device, controlling a transmission interface circuit to perform data transmission between the host device and the memory controller at an original communications speed, for accessing data in the NV memory; in response to the temperature being greater than a first temperature threshold, detecting an increment of the temperature between a first start time point and a first end time point; based on at least one first predetermined rule, determining a first communications speed according to the increment; and switching from the original communications speed to the first communications speed.
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