- 专利标题： Core cavity noise isolation structure for use in chip packages
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申请号： US17315229申请日： 2021-05-07
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公开(公告)号： US11688675B1公开(公告)日： 2023-06-27
- 发明人: Frank Peter Lambrecht , Po-Wei Chiu , Hong Shi
- 申请人： XILINX, INC.
- 申请人地址： US CA San Jose
- 专利权人： XILINX, INC.
- 当前专利权人： XILINX, INC.
- 当前专利权人地址： US CA San Jose
- 代理机构： Patterson + Sheridan, LLP
- 主分类号： H01L23/498
- IPC分类号： H01L23/498 ; H01L21/48 ; H01L23/552
摘要：
Various noise isolation structures and methods for fabricating the same are presented. In one example, a substrate for chip package is provided. The substrate includes a core region, top build-up layers and bottom build-up layers. The top build-up layers are formed on a first side of the core region and the bottom build-up layers are formed on a second side of the core region that is opposite the first side. Routing circuitry formed in the bottom build-up layers is coupled to routing circuitry formed in the top build-up layers by vias formed through the core region. A void is formed in the bottom build-up layers. The void is configured as a noise isolation structure. The void has a sectional area that is different in at least two different distances from the core region.
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