- 专利标题： Electronic assembly that includes interconnected circuit boards
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申请号： US17325131申请日： 2021-05-19
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公开(公告)号： US11688958B2公开(公告)日： 2023-06-27
- 发明人: Julian Arlo Binder , James Chester Meador
- 申请人： Microsoft Technology Licensing, LLC
- 申请人地址： US WA Redmond
- 专利权人： Microsoft Technology Licensing, LLC
- 当前专利权人： Microsoft Technology Licensing, LLC
- 当前专利权人地址： US WA Redmond
- 代理机构： Schwegman Lundberg & Woessner, P.A.
- 主分类号： H01R12/62
- IPC分类号： H01R12/62 ; H01R12/65 ; H05K1/02 ; H05K1/11 ; H05K1/14 ; H05K3/28 ; H05K3/36
摘要：
An electronic assembly that includes a rigid printed circuit board having an upper surface with a first plurality of lands. The electronic assembly further includes a flexible printed circuit board having a second plurality of lands on an upper surface. The lower surface of the flexible printed circuit board is directly attached to the upper surface of the rigid printed circuit board. The electronic assembly further includes a plurality of wires. Each of the wires is bonded to the first plurality of lands on the upper surface of the rigid printed circuit board and the second plurality of lands on the upper surface of the flexible printed circuit board.
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