- Patent Title: Semiconductor device package and acoustic device including the same
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Application No.: US16528308Application Date: 2019-07-31
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Publication No.: US11689839B2Publication Date: 2023-06-27
- Inventor: Ming-Tau Huang
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee Address: TW Kaohsiung
- Agency: Foley & Lardner LLP
- Main IPC: H04R1/10
- IPC: H04R1/10 ; H01L23/31 ; H01Q1/36 ; H01L23/552 ; H01L23/66

Abstract:
A wireless earphone comprises a battery, a speaker and a chamber/space. The battery has a first surface, a second surface opposite the first surface, and a third surface extended between the first surface and the second surface. The battery is disconnected from any protecting circuits. The speaker is disposed adjacent to the first surface of the battery. The chamber/space is defined by the battery and the speaker. The chamber/space is devoid of any electronic component.
Public/Granted literature
- US20210037307A1 SEMICONDUCTOR DEVICE PACKAGE AND ACOUSTIC DEVICE INCLUDING THE SAME Public/Granted day:2021-02-04
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