Invention Grant
- Patent Title: Microelectromechanical system (MEMS) vibration sensor having a segmented backplate
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Application No.: US17351865Application Date: 2021-06-18
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Publication No.: US11691871B2Publication Date: 2023-07-04
- Inventor: Somu Goswami , Christian Bretthauer , Matthias Friedrich Herrmann , Gunar Lorenz
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Slater Matsil, LLP
- Main IPC: B81B7/00
- IPC: B81B7/00 ; H04R3/00
Abstract:
A MEMS vibration sensor includes a membrane having an inertial mass, the membrane being affixed to a holder of the MEMS vibration sensor; and a segmented backplate spaced apart from the membrane, the segmented backplate being affixed to the holder.
Public/Granted literature
- US20220402752A1 Microelectromechanical System (MEMS) Vibration Sensor Having a Segmented Backplate Public/Granted day:2022-12-22
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