Invention Grant
- Patent Title: Apparatus and method for measuring in-situ crosslink density and crosslinked product and method of forming the same
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Application No.: US17115167Application Date: 2020-12-08
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Publication No.: US11692920B2Publication Date: 2023-07-04
- Inventor: Young Suk Jung , Bok Soon Kwon , Joo Young Kim , Don-Wook Lee , Suk Gyu Hahm
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR 20200008089 2020.01.21
- Main IPC: G01N9/36
- IPC: G01N9/36 ; G01N21/31 ; G01N29/04 ; G01N29/24 ; G01N29/46 ; G01N9/00 ; G01N9/24 ; G01N33/44

Abstract:
Disclosed are an apparatus for measuring an in-situ crosslink density includes a support configured to fix or support a cross-linkable structure, a light source configured to irradiate light for crosslinking to the cross-linkable structure, and a probe configured to provide in-situ micro-deformation to the cross-linkable structure, wherein the in-situ crosslink density of the cross-linkable structure is measured from a stress-strain phase lag of the cross-linkable structure by the in-situ micro-deformation, a method of measuring the in-situ crosslink density, a method of manufacturing a crosslinked product, a crosslinked product obtained by the method, and a polymer substrate and an electronic device including the crosslinked product.
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