公开(公告)号：US10712299B2

公开(公告)日：2020-07-14

申请号：US15483776

申请日：2017-04-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ga Hee Kim ,  Young Suk Jung ,  Yoo Seong Yang ,  Young Hoon Lee ,  Hyun Mi Lee

IPC: G01N25/16 ,  G01B5/30

Abstract: A deformation measuring apparatus of a specimen includes: a holder which supports the specimen; a contact portion disposed facing the holder and including a hemispherical tip; a position controlling portion which adjusts a position of the contact portion along a thickness direction of the specimen to allow the hemispherical tip to be in contact with a surface of the specimen; a heating chamber which accommodates the holder and the contact portion and heating the specimen; and a sensing portion which measures at least one of a thermal deformation force (F) of the specimen or a thickness direction thermal expansion (Δh) of the specimen.

公开(公告)号：US11692920B2

公开(公告)日：2023-07-04

申请号：US17115167

申请日：2020-12-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Young Suk Jung ,  Bok Soon Kwon ,  Joo Young Kim ,  Don-Wook Lee ,  Suk Gyu Hahm

IPC: G01N9/36 ,  G01N21/31 ,  G01N29/04 ,  G01N29/24 ,  G01N29/46 ,  G01N9/00 ,  G01N9/24 ,  G01N33/44

CPC classification number: G01N9/36 ,  G01N9/00 ,  G01N9/24 ,  G01N21/31 ,  G01N29/041 ,  G01N29/24 ,  G01N29/46 ,  G01N33/442 ,  G01N2203/0075 ,  G01N2203/0092 ,  G01N2291/01 ,  G01N2291/0235 ,  G01N2291/0251

Abstract: Disclosed are an apparatus for measuring an in-situ crosslink density includes a support configured to fix or support a cross-linkable structure, a light source configured to irradiate light for crosslinking to the cross-linkable structure, and a probe configured to provide in-situ micro-deformation to the cross-linkable structure, wherein the in-situ crosslink density of the cross-linkable structure is measured from a stress-strain phase lag of the cross-linkable structure by the in-situ micro-deformation, a method of measuring the in-situ crosslink density, a method of manufacturing a crosslinked product, a crosslinked product obtained by the method, and a polymer substrate and an electronic device including the crosslinked product.

公开(公告)号：US10444131B2

公开(公告)日：2019-10-15

申请号：US15485745

申请日：2017-04-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hye Young Kong ,  Bok Soon Kwon ,  Young Suk Jung

IPC: G01N3/20

Abstract: An evaluating device of a flexural property includes a holder, a body disposed on the holder and capable of being moved along with a length of direction of the holder, a clamp coupled to the body to be rotated on the body and fixing a first side of the specimen to be evaluated, and a pressing part disposed over the clamp and pressing a second side of the specimen opposite to the first side and disposed upper than the first side of the specimen to bend the specimen, and an evaluation method of a flexural property of the bent specimen using the same.

公开(公告)号：US09925568B2

公开(公告)日：2018-03-27

申请号：US15293448

申请日：2016-10-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seung Yeon Lee ,  Jun Ho Lee ,  Kyungsang Cho ,  Young Suk Jung

IPC: H01L33/06 ,  B08B3/08 ,  B05D1/02 ,  C01B19/00 ,  B22F1/00 ,  B08B3/10 ,  C09K11/02 ,  C09K11/56 ,  C09K11/88 ,  B82Y20/00

CPC classification number: B08B3/08 ,  B05D1/02 ,  B08B3/10 ,  B22F1/0018 ,  B22F1/0085 ,  B22F1/0088 ,  B82Y20/00 ,  C01B19/002 ,  C01B19/007 ,  C01P2002/82 ,  C01P2002/89 ,  C01P2004/04 ,  C01P2004/64 ,  C01P2006/40 ,  C09K11/025 ,  C09K11/565 ,  C09K11/883 ,  H01L33/06 ,  Y10S977/774 ,  Y10S977/95 ,  Y10T428/256

Abstract: A method for removing an organic ligand from a surface of a particle including: obtaining a particle having an organic ligand disposed on a surface thereof; contacting the particle with an alkylammonium salt represented by Chemical Formula 1: NR′4+A−  Chemical Formula 1 wherein groups R′ are the same or different and are each independently hydrogen or a C1 to C20 alkyl group, provided that at least one group R′ is an alkyl group, and A is a hydroxide anion, a halide anion, a borohydride anion, a nitrate anion, a phosphate anion, or a sulfate anion; and heat-treating the particle to carry out a reaction between the alkylammonium salt and the organic ligand.

公开(公告)号：US09492840B2

公开(公告)日：2016-11-15

申请号：US14556613

申请日：2014-12-01

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seung Yeon Lee ,  Jun Ho Lee ,  Kyungsang Cho ,  Young Suk Jung

IPC: B05D1/02 ,  C01B19/00 ,  B22F1/00

CPC classification number: B08B3/08 ,  B05D1/02 ,  B08B3/10 ,  B22F1/0018 ,  B22F1/0085 ,  B22F1/0088 ,  B82Y20/00 ,  C01B19/002 ,  C01B19/007 ,  C01P2002/82 ,  C01P2002/89 ,  C01P2004/04 ,  C01P2004/64 ,  C01P2006/40 ,  C09K11/025 ,  C09K11/565 ,  C09K11/883 ,  H01L33/06 ,  Y10S977/774 ,  Y10S977/95 ,  Y10T428/256

Abstract: A method for removing an organic ligand from a surface of a particle including: obtaining a particle having an organic ligand disposed on a surface thereof; contacting the particle with an alkylammonium salt represented by Chemical Formula 1: NR′4+A−  Chemical Formula 1 wherein groups R′ are the same or different and are each independently hydrogen or a C1 to C20 alkyl group, provided that at least one group R′ is an alkyl group, and A is a hydroxide anion, a halide anion, a borohydride anion, a nitrate anion, a phosphate anion, or a sulfate anion; and heat-treating the particle to carry out a reaction between the alkylammonium salt and the organic ligand.

Abstract translation: 一种从颗粒表面除去有机配体的方法，包括：获得在其表面上具有有机配体的颗粒; 使颗粒与由化学式1表示的烷基铵盐接触：NR'4 + A-化学式1其中基团R'相同或不同，并且各自独立地为氢或C1至C20烷基，条件是至少一个基团 R'是烷基，A是氢氧根阴离子，卤素阴离子，硼氢化物阴离子，硝酸根阴离子，磷酸根阴离子或硫酸根阴离子; 并对该颗粒进行热处理以进行烷基铵盐和有机配体之间的反应。