Invention Grant
- Patent Title: Molded range and proximity sensor with optical resin lens
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Application No.: US17411948Application Date: 2021-08-25
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Publication No.: US11693149B2Publication Date: 2023-07-04
- Inventor: Wing Shenq Wong , Andy Price , Eric Christison
- Applicant: STMICROELECTRONICS (RESEARCH & DEVELOPMENT) LIMITED , STMICROELECTRONICS PTE LTD
- Applicant Address: GB Marlow
- Assignee: STMICROELECTRONICS (RESEARCH & DEVELOPMENT) LIMITED,STMICROELECTRONICS PTE LTD
- Current Assignee: STMICROELECTRONICS (RESEARCH & DEVELOPMENT) LIMITED,STMICROELECTRONICS PTE LTD
- Current Assignee Address: GB Marlow; SG Singapore
- Agency: Seed IP Law Group LLP
- Main IPC: H01L25/16
- IPC: H01L25/16 ; H01L31/167 ; G01V8/12

Abstract:
A method for forming a molded proximity sensor with an optical resin lens and the structure formed thereby. A light sensor chip is placed on a substrate, such as a printed circuit board, and a diode, such as a laser diode, is positioned on top of the light sensor chip and electrically connected to a bonding pad on the light sensor chip. Transparent, optical resin in liquid form is applied as a drop over the light sensor array on the light sensor chip as well as over the light-emitting diode. After the optical resin is cured, a molding compound is applied to an entire assembly, after which the assembly is polished to expose the lenses and have a top surface flush with the top surface of the molding compound.
Public/Granted literature
- US20210382197A1 MOLDED RANGE AND PROXIMITY SENSOR WITH OPTICAL RESIN LENS Public/Granted day:2021-12-09
Information query
IPC分类: