Invention Grant
- Patent Title: Chip on film, display device, method of fabricating chip on film, apparatus for fabricating chip on film
-
Application No.: US17198284Application Date: 2021-03-11
-
Publication No.: US11693287B2Publication Date: 2023-07-04
- Inventor: Myong Soo Oh , Jun O Song , Seung Ho Choi
- Applicant: Samsung Display Co., LTD.
- Applicant Address: KR Yongin-si
- Assignee: Samsung Display Co., LTD.
- Current Assignee: Samsung Display Co., LTD.
- Current Assignee Address: KR Yongin-si
- Agency: H.C. Park & Associates, PLC
- Priority: KR 20200069111 2020.06.08
- Main IPC: G02F1/1362
- IPC: G02F1/1362 ; H01L23/495 ; G02F1/1345 ; H01L23/498 ; H05K1/18

Abstract:
A chip on film for a display device, the chip on film includes: a base substrate; a lead wire disposed on the base substrate; and a driving chip connected to the lead wire, wherein the lead wire includes: a first lead part having a first thickness; and a second lead part disposed between the first lead part and the driving chip and having a second thickness greater than the first thickness, the second lead part being connected to the driving chip. The first lead part and the second lead part include a same material.
Public/Granted literature
- US20210382364A1 CHIP ON FILM, DISPLAY DEVICE, METHOD OF FABRICATING CHIP ON FILM, APPARATUS FOR FABRICATING CHIP ON FILM Public/Granted day:2021-12-09
Information query
IPC分类: