公开(公告)号：US11862601B2

公开(公告)日：2024-01-02

申请号：US17866915

申请日：2022-07-18

Applicant: Samsung Display Co., LTD.

Inventor： Min Sung Kim ,  Myong-Soo Oh ,  Jun O Song ,  Hee Jong Shin

IPC: H01L23/00 ,  G02F1/1345 ,  H10K50/84 ,  G02F1/13 ,  H10K50/805 ,  H10K71/00

CPC classification number: H01L24/83 ,  G02F1/1309 ,  G02F1/13452 ,  H01L24/32 ,  H10K50/805 ,  H10K50/846 ,  H01L2224/32225 ,  H01L2224/8392 ,  H01L2224/83914 ,  H01L2224/83939 ,  H10K71/861

Abstract: A method for manufacturing a display device includes checking a particle positioned between a display panel and a connecting member, irradiating a laser to an upper surface of the connecting member overlapping at least a part of the particle, removing the connecting member overlapping a region to which the laser is irradiated, removing the particle overlapping a region to which the laser is irradiated, and disposing a desiccant in a hole formed by removing the connecting member and the particle.

公开(公告)号：US11410966B2

公开(公告)日：2022-08-09

申请号：US17038682

申请日：2020-09-30

Applicant: Samsung Display Co., LTD.

Inventor： Min Sung Kim ,  Myong-Soo Oh ,  Jun O Song ,  Hee Jong Shin

IPC: H01L23/00 ,  H01L51/52 ,  G02F1/1345 ,  G02F1/13

Abstract: A method for manufacturing a display device includes checking a particle positioned between a display panel and a connecting member, irradiating a laser to an upper surface of the connecting member overlapping at least a part of the particle, removing the connecting member overlapping a region to which the laser is irradiated, removing the particle overlapping a region to which the laser is irradiated, and disposing a desiccant in a hole formed by removing the connecting member and the particle.

公开(公告)号：US11693287B2

公开(公告)日：2023-07-04

申请号：US17198284

申请日：2021-03-11

Applicant: Samsung Display Co., LTD.

Inventor： Myong Soo Oh ,  Jun O Song ,  Seung Ho Choi

IPC: G02F1/1362 ,  H01L23/495 ,  G02F1/1345 ,  H01L23/498 ,  H05K1/18

CPC classification number: G02F1/136295 ,  G02F1/13452 ,  H01L23/4952 ,  H01L23/4985 ,  H05K1/189 ,  H05K2201/09736 ,  H05K2201/10681

Abstract: A chip on film for a display device, the chip on film includes: a base substrate; a lead wire disposed on the base substrate; and a driving chip connected to the lead wire, wherein the lead wire includes: a first lead part having a first thickness; and a second lead part disposed between the first lead part and the driving chip and having a second thickness greater than the first thickness, the second lead part being connected to the driving chip. The first lead part and the second lead part include a same material.

公开(公告)号：US20210382364A1

公开(公告)日：2021-12-09

申请号：US17198284

申请日：2021-03-11

Applicant: Samsung Display Co., LTD

Inventor： Myong Soo OH ,  Jun O Song ,  Seung Ho Choi

IPC: G02F1/1362 ,  H01L23/495

Abstract: A chip on film for a display device, the chip on film includes: a base substrate; a lead wire disposed on the base substrate; and a driving chip connected to the lead wire, wherein the lead wire includes: a first lead part having a first thickness; and a second lead part disposed between the first lead part and the driving chip and having a second thickness greater than the first thickness, the second lead part being connected to the driving chip. The first lead part and the second lead part include a same material.