Invention Grant
- Patent Title: Compound, nanoribbon, and semiconductor device
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Application No.: US17851657Application Date: 2022-06-28
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Publication No.: US11702438B2Publication Date: 2023-07-18
- Inventor: Hideyuki Jippo , Manabu Ohtomo , Hironobu Hayashi , Hiroko Yamada
- Applicant: FUJITSU LIMITED , National University Corporation Nara Institute of Science and Technology
- Applicant Address: JP Kawasaki
- Assignee: FUJITSU LIMITED,NATIONAL UNIVERSITY CORPORATION NARA INSTITUTE OF SCIENCE AND TECHNOLOGY
- Current Assignee: FUJITSU LIMITED,NATIONAL UNIVERSITY CORPORATION NARA INSTITUTE OF SCIENCE AND TECHNOLOGY
- Current Assignee Address: JP Kawasaki; JP Ikoma
- Agency: WHDA, LLP
- Priority: JP 19036472 2019.02.28
- The original application number of the division: US16777450 2020.01.30
- Main IPC: C07F15/00
- IPC: C07F15/00 ; C07D403/00 ; H01B1/12 ; C07F15/06 ; C07D403/14 ; C07F3/02 ; C07F7/28 ; C07F15/02 ; C07F15/04 ; B82Y30/00 ; B82Y40/00
Abstract:
A nanoribbon includes a structure represented by a structural formula (8), where g, p, q, r, s, t, and u are mutually independent and are integers greater than or equal to 1, R1, R2, R3, R4, R5, R6, R7, and R8 are mutually independent and are one of a hydrogen atom, a substituent, an alkyl moiety, a phenyl moiety, and a halogen atom, and A denotes a hydrogen atom or an aryl group.
Public/Granted literature
- US20220332743A1 COMPOUND, NANORIBBON, AND SEMICONDUCTOR DEVICE Public/Granted day:2022-10-20
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