- 专利标题: Polyamide-imide film and method for preparing same
-
申请号: US16477697申请日: 2018-02-05
-
公开(公告)号: US11702519B2公开(公告)日: 2023-07-18
- 发明人: Dawoo Jeong , Sunhwan Kim , Jin Woo Lee , Dae Seong Oh , Dong Jin Lim
- 申请人: SK microworks Co., Ltd.
- 申请人地址: KR Gyeonggi-do
- 专利权人: SKC microworks CO., LTD.
- 当前专利权人: SKC microworks CO., LTD.
- 当前专利权人地址: KR Gyeonggi-do
- 代理机构: IP & T Group LLP
- 优先权: KR 20170017550 2017.02.08 KR 20170121939 2017.09.21
- 国际申请: PCT/KR2018/001498 2018.02.05
- 国际公布: WO2018/147606A 2018.08.16
- 进入国家日期: 2019-07-12
- 主分类号: C08J5/18
- IPC分类号: C08J5/18 ; C08G73/14 ; B29C39/24 ; B29C39/38 ; B29C39/42 ; B29C39/44 ; C08G73/10 ; C08L79/08 ; B29C41/00 ; B29K77/00 ; B29K105/00
摘要:
An embodiment can provide a polyamide-imide film, which has particular punching properties, is colorless and transparent and has excellent mechanical properties and optical properties, and a method for preparing same. The polyamide-imide film comprises a polyamide-imide polymer, which is formed by means of polymerizing an aromatic diamine compound, an aromatic dianhydride compound and a dicarbonyl compound, and satisfies the condition of general formula (1) below. General formula (1) 4≤X/Y≤12 X: the maximum hole diameter (mm) comprising cracks when the film is punched at 10 mm/min using a 2.5 mm spherical tip by means of a UTM compression mode Y: the modulus (GPa) of the film.
信息查询