公开(公告)号：US11702519B2

公开(公告)日：2023-07-18

申请号：US16477697

申请日：2018-02-05

申请人： SK microworks Co., Ltd.

发明人： Dawoo Jeong ,  Sunhwan Kim ,  Jin Woo Lee ,  Dae Seong Oh ,  Dong Jin Lim

IPC分类号： C08J5/18 ,  C08G73/14 ,  B29C39/24 ,  B29C39/38 ,  B29C39/42 ,  B29C39/44 ,  C08G73/10 ,  C08L79/08 ,  B29C41/00 ,  B29K77/00 ,  B29K105/00

CPC分类号： C08J5/18 ,  B29C39/24 ,  B29C39/38 ,  B29C39/42 ,  B29C39/44 ,  C08G73/1039 ,  C08G73/14 ,  C08L79/08 ,  B29C41/003 ,  B29K2077/00 ,  B29K2105/0094 ,  C08J2379/08 ,  C08L2201/10 ,  C08L2203/16

摘要： An embodiment can provide a polyamide-imide film, which has particular punching properties, is colorless and transparent and has excellent mechanical properties and optical properties, and a method for preparing same. The polyamide-imide film comprises a polyamide-imide polymer, which is formed by means of polymerizing an aromatic diamine compound, an aromatic dianhydride compound and a dicarbonyl compound, and satisfies the condition of general formula (1) below. General formula (1) 4≤X/Y≤12 X: the maximum hole diameter (mm) comprising cracks when the film is punched at 10 mm/min using a 2.5 mm spherical tip by means of a UTM compression mode Y: the modulus (GPa) of the film.