Invention Grant
- Patent Title: Hinge mechanism and foldable electronic device
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Application No.: US17514596Application Date: 2021-10-29
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Publication No.: US11703916B2Publication Date: 2023-07-18
- Inventor: Haiqiang Tian , Weifeng Wu , Tao Huang , Li Liao , Feng Zhao , Gang Wang
- Applicant: Huawei Technologies Co., Ltd.
- Applicant Address: CN Shenzhen
- Assignee: HUAWEI TECHNOLOGIES CO., LTD.
- Current Assignee: HUAWEI TECHNOLOGIES CO., LTD.
- Current Assignee Address: CN Shenzhen
- Agency: Conley Rose, P.C.
- Priority: CN 2011198925.3 2020.10.31
- Main IPC: G06F1/16
- IPC: G06F1/16 ; G09F9/30

Abstract:
A hinge mechanism includes a first lap joint structure disposed on one end of each linkage component rotatably connected to a base, and extends in a direction from one end of the base to a mounting bracket located on a same side as the first lap joint structure, and a second lap joint structure disposed on one side of each support plate and that faces the base and extends in a direction from the side of the support plate to the base, wherein a second surface of the second lap joint structure slides along a surface of the first lap joint structure when two mounting brackets are relatively folded or unfolded.
Public/Granted literature
- US20220137676A1 Hinge Mechanism and Foldable Electronic Device Public/Granted day:2022-05-05
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