Invention Grant
- Patent Title: Method for accessing flash memory module and associated package
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Application No.: US16860093Application Date: 2020-04-28
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Publication No.: US11704234B2Publication Date: 2023-07-18
- Inventor: Tsung-Chieh Yang
- Applicant: Silicon Motion, Inc.
- Applicant Address: TW Hsinchu County
- Assignee: Silicon Motion, Inc.
- Current Assignee: Silicon Motion, Inc.
- Current Assignee Address: TW Hsinchu County
- Agent Winston Hsu
- Main IPC: G06F12/02
- IPC: G06F12/02 ; G11C16/28 ; G11C16/08 ; G11C16/04 ; G06F3/06 ; G06F9/4401

Abstract:
The present invention provides a method for accessing a flash memory module is disclosed, wherein the flash memory module includes at least one flash memory chip, each flash memory chip includes a plurality of block, each block is implemented by a plurality of word lines, each word line corresponds to K pages, and each word line includes a plurality of memory cells supporting a plurality of states, and the method includes the steps of: receiving data from a host device; generating dummy data; and writing the data with the dummy data to a plurality of specific blocks, wherein for each of a portion of the word lines of the specific blocks, the dummy data is written into at least one of the K pages, and the data from the host device is written into the other page(s) of the K pages.
Public/Granted literature
- US20210334202A1 METHOD FOR ACCESSING FLASH MEMORY MODULE AND ASSOCIATED PACKAGE Public/Granted day:2021-10-28
Information query