Invention Grant
- Patent Title: Vertically adjustable plasma source
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Application No.: US17134280Application Date: 2020-12-26
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Publication No.: US11705312B2Publication Date: 2023-07-18
- Inventor: Tsutomu Tanaka , Jared Ahmad Lee , Rakesh Ramadas , Dmitry A. Dzilno , Gregory J. Wilson , Sriharish Srinivasan
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Servilla Whitney LLC
- Main IPC: H01J37/32
- IPC: H01J37/32

Abstract:
The disclosure describes a plasma source assemblies comprising a differential screw assembly, an RF hot electrode, a top cover, an upper housing and a lower housing. The differential screw assembly is configured to provide force to align the plasma source assembly vertically matching planarity of a susceptor. More particularly, the differential screw assembly increases a distance between the top cover and the upper housing to align the gap with the susceptor. The disclosure also provides a better thermal management by cooling fins. A temperature capacity of the plasma source assemblies is extended by using titanium electrode. The disclosure provides a cladding material covering a portion of a first surface of RF hot electrode, a second surface of RF hot electrode, a bottom surface of RF hot electrode, a portion of a surface of the showerhead and a portion of lower housing surface.
Public/Granted literature
- US20220208531A1 VERTICALLY ADJUSTABLE PLASMA SOURCE Public/Granted day:2022-06-30
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