Invention Grant
- Patent Title: Semiconductor package structure and method for manufacturing the same
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Application No.: US17225832Application Date: 2021-04-08
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Publication No.: US11705401B2Publication Date: 2023-07-18
- Inventor: You-Lung Yen , Bernd Karl Appelt , Kay Stefan Essig
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee Address: TW Kaohsiung
- Agency: Foley & Lardner LLP
- Main IPC: H01L23/538
- IPC: H01L23/538 ; H01L23/00 ; H01L23/31 ; H01L23/49 ; H01L21/48 ; H01L21/56
Abstract:
A semiconductor package structure and a method for manufacturing a semiconductor package structure are provided. The semiconductor package structure includes a substrate and a first passive device. The substrate has a first surface and a second surface opposite to the first surface. The first passive device includes a first terminal and a second terminal, wherein the first terminal is closer to the first surface than to the second surface, and the second terminal is closer to the second surface than to the first surface.
Public/Granted literature
- US20220328416A1 SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2022-10-13
Information query
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