Invention Grant
- Patent Title: Integrated circuit devices and fabrication techniques
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Application No.: US17159013Application Date: 2021-01-26
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Publication No.: US11705458B2Publication Date: 2023-07-18
- Inventor: John H. Zhang
- Applicant: STMICROELECTRONICS, INC.
- Applicant Address: US TX Coppell
- Assignee: STMICROELECTRONICS, INC.
- Current Assignee: STMICROELECTRONICS, INC.
- Current Assignee Address: US TX Coppell
- Agency: Seed IP Law Group LLP
- Main IPC: H01L27/12
- IPC: H01L27/12 ; H01L21/266 ; H01L21/8238 ; H01L21/84 ; H01L23/528 ; H01L27/092 ; H01L29/06 ; H01L29/66 ; H01L29/161 ; H01L29/78 ; H10B10/00 ; H10B20/00

Abstract:
Single gate and dual gate FinFET devices suitable for use in an SRAM memory array have respective fins, source regions, and drain regions that are formed from portions of a single, contiguous layer on the semiconductor substrate, so that STI is unnecessary. Pairs of FinFETs can be configured as dependent-gate devices wherein adjacent channels are controlled by a common gate, or as independent-gate devices wherein one channel is controlled by two gates. Metal interconnects coupling a plurality of the FinFET devices are made of a same material as the gate electrodes. Such structural and material commonalities help to reduce costs of manufacturing high-density memory arrays.
Public/Granted literature
- US20210391356A1 INTEGRATED CIRCUIT DEVICES AND FABRICATION TECHNIQUES Public/Granted day:2021-12-16
Information query
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