- Patent Title: High electron mobility transistor (HEMT) and forming method thereof
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Application No.: US17676799Application Date: 2022-02-21
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Publication No.: US11705512B2Publication Date: 2023-07-18
- Inventor: Kuo-Hsing Lee , Yi-Chung Sheng , Sheng-Yuan Hsueh , Chih-Kai Kang , Guan-Kai Huang , Chien-Liang Wu
- Applicant: UNITED MICROELECTRONICS CORP.
- Applicant Address: TW Hsin-Chu
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Hsin-Chu
- Agent Winston Hsu
- Priority: CN 1910649098.6 2019.07.18
- Main IPC: H01L29/778
- IPC: H01L29/778 ; H01L29/66

Abstract:
A high electron mobility transistor (HEMT) includes a carrier transit layer, a carrier supply layer, a main gate, a control gate, a source electrode and a drain electrode. The carrier transit layer is on a substrate. The carrier supply layer is on the carrier transit layer. The main gate and the control gate are on the carrier supply layer. A fluoride ion doped region is formed right below the main gate in the carrier supply layer. The source electrode and the drain electrode are at two opposite sides of the main gate and the control gate, wherein the source electrode is electrically connected to the control gate by a metal interconnect. The present invention also provides a method of forming a high electron mobility transistor (HEMT).
Public/Granted literature
- US20220173236A1 HIGH ELECTRON MOBILITY TRANSISTOR (HEMT) AND FORMING METHOD THEREOF Public/Granted day:2022-06-02
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